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Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021006.
Paper No: EP-15-1051
https://doi.org/10.1115/1.4033106
Published Online: April 15, 2016
View Article titled, Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis
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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Article titled, Design for Reliability Applied to Packaging of a MOEMS Switch
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Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
View Article titled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
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Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis