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Journal Articles

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

Accepted Manuscript
Ekene Okafor, Collin Ruby, Mathew Norris, Andrew Leda, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1081
https://doi.org/10.1115/1.4067189
Published Online: November 20, 2024
View Article titled, Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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Topics: Reliability, Solder joints, Stress, Failure mechanisms, Temperature, Current density, Electrodiffusion, Fatigue, Risk, Data collection
Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
https://doi.org/10.1115/1.4039301
Published Online: May 9, 2018
View Article titled, Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue
Journal Articles

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

Kurt A. Estes, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 323–332.
https://doi.org/10.1115/1.2792112
Published Online: December 1, 1995
View Article titled, Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
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Topics: Computer cooling, Jets, Sprays, Cooling, Critical heat flux, Subcooling, Flow (Dynamics), Liquid films, Boiling, Coolants
Journal Articles

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 225–232.
https://doi.org/10.1115/1.2909322
Published Online: September 1, 1993
View Article titled, Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
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Topics: Adhesion, Acoustics, Cracking (Materials), Deformation, Delamination, Design, Epoxy adhesives, Epoxy resins, Fatigue failure, Finite element analysis