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Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Article titled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Article titled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
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Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

Mechanical Evaluation of the “Euler” Test Probe

E. Suhir, W. E. Benedetto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 75–77.
https://doi.org/10.1115/1.2904344
Published Online: March 1, 1990
View Article titled, Mechanical Evaluation of the “Euler” Test Probe
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Topics: Probes, Wire, Stress, Buckling, Deflection, Design, Mechanical behavior
Journal Articles

An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water

Y. Joshi, T. Willson, S. J. Hazard, III
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 121–128.
https://doi.org/10.1115/1.3226516
Published Online: June 1, 1989
View Article titled, An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water
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Topics: Natural convection, Water, Fluids, Transients (Dynamics), Accounting, Energy dissipation, Flow (Dynamics), Heat transfer, Probes, Steady state