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Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
https://doi.org/10.1115/1.4047845
Published Online: August 5, 2020
View Article titled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage
Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
https://doi.org/10.1115/1.1328744
Published Online: October 10, 2000
View Article titled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
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Topics: Displacement, Finite element analysis, Potential energy, Stress, Stress analysis (Engineering), Creep, Thermomechanics, Electronic products
Journal Articles

Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components

N. van Veen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 116–121.
https://doi.org/10.1115/1.2792665
Published Online: June 1, 1999
View Article titled, Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components
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Topics: Damping, Flip-chip, Flip-chip devices, Potential energy, Resonance, Solders
Journal Articles

A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis

S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 177–182.
https://doi.org/10.1115/1.2792231
Published Online: September 1, 1997
View Article titled, A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis
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Topics: Solder joints, Stress analysis (Engineering), Surface mount packaging, Thermomechanics, Stress, Deformation, Displacement, Potential energy, Printed circuit boards, Materials properties
Journal Articles

Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

N. J. Nigro, F. J. Zhou, S. M. Heinrich, A. F. Elkouh, R. A. Fournelle, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 142–147.
https://doi.org/10.1115/1.2792144
Published Online: September 1, 1996
View Article titled, Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints
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Topics: Finite element methods, Shapes, Solder joints, Boundary-value problems, Finite element analysis, Interpolation, Potential energy, Solders
Journal Articles

Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

N. J. Nigro, S. M. Heinrich, A. F. Elkouh, X. Zou, R. Fournelle, Ping S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 141–146.
https://doi.org/10.1115/1.2909309
Published Online: June 1, 1993
View Article titled, Finite Element Method for Predicting Equilibrium Shapes of Solder Joints
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Topics: Equilibrium (Physics), Finite element methods, Shapes, Solder joints, Finite element analysis, Potential energy, Interpolation, Stress, Surface mount packaging, Theorems (Mathematics)