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Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu

J. Electron. Packag. March 2021, 143(1): 011003.

Paper No: EP-19-1078

DOI: https://doi.org/10.1115/1.4046762

Published Online: June 4, 2020

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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins

Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome

J. Electron. Packag. June 2018, 140(2): 021002.

Paper No: EP-17-1125

DOI: https://doi.org/10.1115/1.4039706

Published Online: May 9, 2018

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Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection

Journal Articles

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

Abderrahmane Baïri, Bruno Chanetz, J. A. Millán-García

J. Electron. Packag. December 2017, 139(4): 041009.

Paper No: EP-16-1124

DOI: https://doi.org/10.1115/1.4038113

Published Online: October 25, 2017

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Topics: Adhesives, Junctions, Natural convection, Reliability, Temperature, Thermal conductivity, Packaging

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik

J. Electron. Packag. December 2015, 137(4): 041006.

Paper No: EP-14-1089

DOI: https://doi.org/10.1115/1.4031480

Published Online: October 15, 2015

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Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants

Journal Articles

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

James Petroski

J. Electron. Packag. December 2014, 136(4): 041005.

Paper No: EP-13-1106

DOI: https://doi.org/10.1115/1.4028331

Published Online: September 19, 2014

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Topics: Cooling, Design, Heat sinks, Natural convection, Light-emitting diodes

Journal Articles

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Kyoung Joon Kim

J. Electron. Packag. March 2014, 136(1): 011002.

Paper No: EP-13-1047

DOI: https://doi.org/10.1115/1.4025673

Published Online: November 22, 2013

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Topics: Forced convection, Heat sinks, Light-emitting diodes, Natural convection, Temperature, Heat

Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

A. Tamayol, F. McGregor, M. Bahrami

J. Electron. Packag. September 2012, 134(3): 034501.

DOI: https://doi.org/10.1115/1.4007077

Published Online: July 24, 2012

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Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature

Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu

J. Electron. Packag. March 2012, 134(1): 014501.

DOI: https://doi.org/10.1115/1.4005908

Published Online: March 19, 2012

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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection

Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003.

DOI: https://doi.org/10.1115/1.4003217

Published Online: March 3, 2011

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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection

Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran

J. Electron. Packag. September 2010, 132(3): 031007.

DOI: https://doi.org/10.1115/1.4002009

Published Online: September 9, 2010

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Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization

Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

David Newport, Colin Forno, Maurice Whelan

J. Electron. Packag. September 2010, 132(3): 031001.

DOI: https://doi.org/10.1115/1.4002161

Published Online: September 8, 2010

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Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling

Journal Articles

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

G. De Mey, M. Wójcik, J. Pilarski, M. Lasota, J. Banaszczyk, B. Vermeersch, A. Napieralski, M. De Paepe

J. Electron. Packag. March 2009, 131(1): 014501.

DOI: https://doi.org/10.1115/1.3068307

Published Online: February 12, 2009

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Topics: Cooling, Natural convection, Thermal resistance, Transistors, Junctions

Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei

J. Electron. Packag. March 2008, 130(1): 011006.

DOI: https://doi.org/10.1115/1.2837524

Published Online: January 31, 2008

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Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation

Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2006, 128(4): 370–379.

DOI: https://doi.org/10.1115/1.2351902

Published Online: December 24, 2005

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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat

Journal Articles

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham

J. Electron. Packag. June 2006, 128(2): 157–165.

DOI: https://doi.org/10.1115/1.2188953

Published Online: September 28, 2005

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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation

Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi

J. Electron. Packag. December 2005, 127(4): 503–511.

DOI: https://doi.org/10.1115/1.2065727

Published Online: April 20, 2005

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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling

Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Yoji Kitamura, Masaru Ishizuka

J. Electron. Packag. December 2004, 126(4): 423–428.

DOI: https://doi.org/10.1115/1.1827256

Published Online: January 24, 2005

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Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation

Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

J. Electron. Packag. December 2004, 126(4): 449–456.

DOI: https://doi.org/10.1115/1.1827260

Published Online: January 24, 2005

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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions

Journal Articles

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

C. P. Tso, K. W. Tou, H. Bhowmik

J. Electron. Packag. December 2004, 126(4): 546–553.

DOI: https://doi.org/10.1115/1.1827270

Published Online: January 24, 2005

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Topics: Natural convection, Steady state, Transients (Dynamics), Heat, Temperature, Flow (Dynamics), Coolants, Water, Heat transfer, Pumps

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Journal citation

NARROW

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Modeling of Natural Convection in Electronic Enclosures

Meso Scale Pulsating Jets for Electronics Cooling

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

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