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Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
https://doi.org/10.1115/1.4007812
Published Online: November 26, 2012
View Article titled, Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems
Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

David Newport, Colin Forno, Maurice Whelan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031001.
https://doi.org/10.1115/1.4002161
Published Online: September 8, 2010
View Article titled, Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
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Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
https://doi.org/10.1115/1.2804091
Published Online: February 13, 2007
View Article titled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
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Topics: Ball-Grid-Array packaging, Ceramics, Fatigue life, Solders, Ball-Grid-Array packages, Interferometry, Lasers
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 41–47.
https://doi.org/10.1115/1.1646426
Published Online: April 30, 2004
View Article titled, Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
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Topics: Ceramics, Deformation, Manufacturing, Solders, Temperature, Interferometry, Ball-Grid-Array packages, Stress, Displacement
Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
https://doi.org/10.1115/1.1571571
Published Online: June 10, 2003
View Article titled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
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Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature
Journal Articles

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Keith B. Bowman, David H. Mollenhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
https://doi.org/10.1115/1.1497627
Published Online: December 12, 2002
View Article titled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
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Topics: Interferometry, Polymers, Residual stresses, Stress, Laminates, Temperature, Displacement, Stress concentration
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
https://doi.org/10.1115/1.1478060
Published Online: July 26, 2002
View Article titled, Validation of Electronic Package Reliability Using Speckle Interferometry
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Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles
Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

B. Han, Mem. ASME, P. Kunthong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
https://doi.org/10.1115/1.1290000
Published Online: May 15, 2000
View Article titled, Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
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Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability
Journal Articles

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 227–232.
https://doi.org/10.1115/1.1286315
Published Online: December 20, 1999
View Article titled, Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Surface roughness, Warping, Microelectronic devices
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Article titled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

H. Krishnamoorthy, H. V. Tippur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 267–274.
https://doi.org/10.1115/1.2792632
Published Online: September 1, 1998
View Article titled, Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry
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Topics: Copper, Fracture (Materials), Fracture (Process), Interferometry, Solders, Deformation, Failure, Fracture toughness, Geometry, Strain gages
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Article titled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)
Journal Articles

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 160–165.
https://doi.org/10.1115/1.2792609
Published Online: June 1, 1998
View Article titled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement
Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 179–185.
https://doi.org/10.1115/1.2792617
Published Online: June 1, 1998
View Article titled, Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry
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Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis
Journal Articles

Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study

B. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 189–196.
https://doi.org/10.1115/1.2792233
Published Online: September 1, 1997
View Article titled, Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study
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Topics: Deformation, Solders, Cycles, Manufacturing, Ceramics, Displacement, Interferometry, Reliability, Shapes, Thermomechanics
Journal Articles

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 157–163.
https://doi.org/10.1115/1.2792146
Published Online: September 1, 1996
View Article titled, Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
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Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling