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Journal Articles

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031009.
Paper No: EP-19-1009
https://doi.org/10.1115/1.4043483
Published Online: May 17, 2019
View Article titled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Boiling, Flow (Dynamics), Gravity (Force), Heat flux
Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
View Article titled, An Investigation of Flat-Plate Oscillating Heat Pipes
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Analysis of Tombstoning Phenomenon During Reflow

Q. Qi, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 61–67.
https://doi.org/10.1115/1.2792287
Published Online: March 1, 1998
View Article titled, Analysis of Tombstoning Phenomenon During Reflow
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Topics: Algebra, Dynamic models, Equations of motion, Geometry, Gravity (Force), Solders
Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 433–439.
https://doi.org/10.1115/1.2909353
Published Online: December 1, 1993
View Article titled, Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers
Journal Articles

Shape and Force Relationships for Molten Axisymmetric Solder Connections

R. H. Katyl, W. T. Pimbley
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 336–341.
https://doi.org/10.1115/1.2905460
Published Online: September 1, 1992
View Article titled, Shape and Force Relationships for Molten Axisymmetric Solder Connections
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Topics: Shapes, Solders, Collapse, Computational methods, Equilibrium (Physics), Gravity (Force), Surface tension
Journal Articles

Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 290–299.
https://doi.org/10.1115/1.2905453
Published Online: September 1, 1992
View Article titled, Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling
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Topics: Boiling, Critical heat flux, Flow (Dynamics), Coolants, Cooling systems, Flux (Metallurgy), Gravity (Force), Heat transfer coefficients, Multi-chip modules, Packaging