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Journal Articles

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Publisher: ASME

J. Electron. Packag. June 2022, 144(2): 021107.

Paper No: EP-21-1056

https://doi.org/10.1115/1.4052408

Published Online: October 6, 2021

View Article titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Topics: Capacitance, Coolants, Gates (Closures), MOSFET transistors, Reliability, Temperature, Traction, Roads, Thermal resistance

Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi

Publisher: ASME

J. Electron. Packag. September 2020, 142(3): 031113.

Paper No: EP-20-1012

https://doi.org/10.1115/1.4047100

Published Online: May 21, 2020

View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

Publisher: ASME

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi

Publisher: ASME

J. Electron. Packag. June 2020, 142(2): 021012.

Paper No: EP-19-1087

https://doi.org/10.1115/1.4046620

Published Online: April 6, 2020

View Article titled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation

Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

Publisher: ASME

J. Electron. Packag. September 2019, 141(3): 031007.

Paper No: EP-18-1093

https://doi.org/10.1115/1.4043477

Published Online: May 17, 2019

View Article titled, Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis

Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang

Publisher: ASME

J. Electron. Packag. December 2018, 140(4): 041002.

Paper No: EP-18-1007

https://doi.org/10.1115/1.4040670

Published Online: August 3, 2018

View Article titled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)

Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar

Publisher: ASME

J. Electron. Packag. September 2018, 140(3): 031009.

Paper No: EP-17-1113

https://doi.org/10.1115/1.4040499

Published Online: July 2, 2018

View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks

Journal Articles

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

J. H. L. Ling, A. A. O. Tay

Publisher: ASME

J. Electron. Packag. March 2014, 136(1): 011007.

Paper No: EP-13-1072

https://doi.org/10.1115/1.4026352

Published Online: January 16, 2014

View Article titled, A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

Topics: Gates (Closures), Heat, Temperature, Temperature distribution, Junctions, Finite element analysis, Thermal conductivity

Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng

Publisher: ASME

J. Electron. Packag. March 2011, 133(1): 011008.

https://doi.org/10.1115/1.4003214

Published Online: March 10, 2011

View Article titled, Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)

Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori

Publisher: ASME

J. Electron. Packag. September 2010, 132(3): 031012.

https://doi.org/10.1115/1.4002451

Published Online: September 30, 2010

View Article titled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding

Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 319.

https://doi.org/10.1115/1.1387243

Published Online: September 1, 2001

View Article titled, Industrial Electonics: Devices and Systems, Second Edition

Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering

Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger

Publisher: ASME

J. Electron. Packag. December 2001, 123(4): 366–371.

https://doi.org/10.1115/1.1388562

Published Online: February 6, 2001

View Article titled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)

Journal Articles

Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding

E. Suhir, L. T. Manzione

Publisher: ASME

J. Electron. Packag. December 1991, 113(4): 421–425.

https://doi.org/10.1115/1.2905430

Published Online: December 1, 1991

View Article titled, Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding

Topics: Deformation, Molding, Deflection, Flow (Dynamics), Stress, Density, Design, Diluents, Gates (Closures), Geometry

Journal citation

NARROW

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Industrial Electonics: Devices and Systems, Second Edition

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding

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