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Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi

J. Electron. Packag. September 2021, 143(3): 031006.

Paper No: EP-19-1118

DOI: https://doi.org/10.1115/1.4049564

Published Online: February 19, 2021

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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)

Journal Articles

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen

J. Electron. Packag. March 2021, 143(1): 011004.

Paper No: EP-19-1095

DOI: https://doi.org/10.1115/1.4047338

Published Online: June 4, 2020

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Topics: Adhesion, Copper, Flux (Metallurgy), Shear (Mechanics)

Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won

J. Electron. Packag. September 2019, 141(3): 031013.

Paper No: EP-18-1104

DOI: https://doi.org/10.1115/1.4044373

Published Online: September 19, 2019

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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability

Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao

J. Electron. Packag. September 2019, 141(3): 031006.

Paper No: EP-18-1092

DOI: https://doi.org/10.1115/1.4043476

Published Online: May 17, 2019

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

DOI: https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006.

Paper No: EP-16-1097

DOI: https://doi.org/10.1115/1.4035387

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management

Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. March 2016, 138(1): 010907.

Paper No: EP-15-1104

DOI: https://doi.org/10.1115/1.4032655

Published Online: March 10, 2016

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation

Journal Articles

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir

J. Electron. Packag. December 2015, 137(4): 040802.

Paper No: EP-15-1068

DOI: https://doi.org/10.1115/1.4031481

Published Online: September 25, 2015

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Topics: Coolants, Cooling, Design, Flow (Dynamics), Fluids, Heat sinks, Heat, Flux (Metallurgy), Temperature, Pressure

Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette

J. Electron. Packag. December 2014, 136(4): 041003.

Paper No: EP-13-1098

DOI: https://doi.org/10.1115/1.4026353

Published Online: September 19, 2014

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Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol

Journal Articles

Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding

Tannaz Harirchian, Suresh V. Garimella

J. Electron. Packag. March 2011, 133(1): 011001.

DOI: https://doi.org/10.1115/1.4002721

Published Online: March 2, 2011

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Topics: Boiling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Microchannels, Vapors, Pressure drop, Heat flux, Heat, Flux (Metallurgy)

Journal Articles

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Craig Green, Andrei G. Fedorov, Yogendra K. Joshi

J. Electron. Packag. June 2009, 131(2): 025002.

DOI: https://doi.org/10.1115/1.3104029

Published Online: April 3, 2009

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Topics: Coolants, Cooling, Design, Fluids, Heat, Heat sinks, Flow (Dynamics), Heat flux, Stress, Flux (Metallurgy)

Journal Articles

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella

J. Electron. Packag. December 2006, 128(4): 398–404.

DOI: https://doi.org/10.1115/1.2351905

Published Online: February 1, 2006

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Topics: Boiling, Bubbles, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Wall temperature, Flow instability

Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag. December 2004, 126(4): 457–464.

DOI: https://doi.org/10.1115/1.1827261

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods

Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,

J. Electron. Packag. June 2003, 125(2): 244–250.

DOI: https://doi.org/10.1115/1.1569508

Published Online: June 10, 2003

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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number

Journal Articles

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

L. Tang, Y. K. Joshi

J. Electron. Packag. June 1999, 121(2): 108–115.

DOI: https://doi.org/10.1115/1.2792664

Published Online: June 1, 1999

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Topics: Natural convection, Thermal analysis, Boundary-value problems, Computational fluid dynamics, Temperature, Ceramics, Electronic components, Electronic systems, Flux (Metallurgy), Heat

Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

A. K. Mallik, G. P. Peterson

J. Electron. Packag. March 1995, 117(1): 75–81.

DOI: https://doi.org/10.1115/1.2792070

Published Online: March 1, 1995

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Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)

Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

M. B. Bowers, I. Mudawar

J. Electron. Packag. December 1994, 116(4): 298–305.

DOI: https://doi.org/10.1115/1.2905701

Published Online: December 1, 1994

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Topics: Computer cooling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Geometry, Compressibility, Energy dissipation, Heat, Boiling

Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1994, 116(1): 44–48.

DOI: https://doi.org/10.1115/1.2905492

Published Online: March 1, 1994

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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat

Journal Articles

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison

J. Electron. Packag. September 1993, 115(3): 284–291.

DOI: https://doi.org/10.1115/1.2909330

Published Online: September 1, 1993

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Topics: Cooling, Heat sinks, Boiling, Heat, Silicon, Cavities, Atmospheric pressure, Etching, Flux (Metallurgy), Heat transfer

Journal Articles

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

I. Mudawar, T. M. Anderson

J. Electron. Packag. March 1993, 115(1): 89–100.

DOI: https://doi.org/10.1115/1.2909306

Published Online: March 1, 1993

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Topics: Cooling, Optimization, Pool boiling, Boiling, Boundary-value problems, Flux (Metallurgy), Heat, Metal surfaces, Nucleate boiling, Subcooling

Journal citation

NARROW

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

Evaporative Wicking Phenomena on Nanotextured Surfaces

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

Heat Transfer in Wire Bonding Process

An Integral Heat Sink for Cooling Microelectronic Components

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

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