Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 29

Sort by

Sort Order Select

Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

View Article

Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

View Article

Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2021, 143(4): 041103.

Paper No: EP-21-1083

DOI: https://doi.org/10.1115/1.4051943

Published Online: August 27, 2021

View Article

Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling

Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004.

Paper No: EP-20-1034

DOI: https://doi.org/10.1115/1.4048493

Published Online: October 12, 2020

View Article

Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington

J. Electron. Packag. March 2021, 143(1): 011010.

Paper No: EP-19-1130

DOI: https://doi.org/10.1115/1.4047576

Published Online: July 10, 2020

View Article

Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites

Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan

J. Electron. Packag. June 2017, 139(2): 020907.

Paper No: EP-16-1139

DOI: https://doi.org/10.1115/1.4036403

Published Online: June 12, 2017

View Article

Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

View Article

Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar

J. Electron. Packag. March 2015, 137(1): 010801.

Paper No: EP-14-1069

DOI: https://doi.org/10.1115/1.4028890

Published Online: November 14, 2014

View Article

Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity

Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami

J. Electron. Packag. September 2014, 136(3): 031010.

Paper No: EP-14-1011

DOI: https://doi.org/10.1115/1.4027509

Published Online: May 12, 2014

View Article

Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)

Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. September 2013, 135(3): 031006.

Paper No: EP-13-1006

DOI: https://doi.org/10.1115/1.4024653

Published Online: June 24, 2013

View Article

Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes

Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng

J. Electron. Packag. March 2011, 133(1): 011008.

DOI: https://doi.org/10.1115/1.4003214

Published Online: March 10, 2011

View Article

Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)

Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei

J. Electron. Packag. September 2007, 129(3): 348–355.

DOI: https://doi.org/10.1115/1.2753970

Published Online: December 19, 2006

View Article

Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation

Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. September 2007, 129(3): 366–370.

DOI: https://doi.org/10.1115/1.2753988

Published Online: September 12, 2006

View Article

Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature

Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann

J. Electron. Packag. June 2006, 128(2): 130–136.

DOI: https://doi.org/10.1115/1.2188952

Published Online: February 14, 2006

View Article

Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon

Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2006, 128(4): 370–379.

DOI: https://doi.org/10.1115/1.2351902

Published Online: December 24, 2005

View Article

Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat

Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia

J. Electron. Packag. March 2006, 128(1): 10–17.

DOI: https://doi.org/10.1115/1.2159003

Published Online: May 18, 2005

View Article

Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management

Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

J. Electron. Packag. December 2004, 126(4): 449–456.

DOI: https://doi.org/10.1115/1.1827260

Published Online: January 24, 2005

View Article

Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions

Journal Articles

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev

J. Electron. Packag. December 2004, 126(4): 435–439.

DOI: https://doi.org/10.1115/1.1826079

Published Online: January 24, 2005

View Article

Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon

Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student

J. Electron. Packag. September 2004, 126(3): 374–383.

DOI: https://doi.org/10.1115/1.1773198

Published Online: October 6, 2004

View Article

Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection

Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

J. Electron. Packag. June 2003, 125(2): 192–199.

DOI: https://doi.org/10.1115/1.1568127

Published Online: June 10, 2003

View Article

Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer

Journal citation

NARROW

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

3D Compact Model of Packaged Thermoelectric Coolers

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Thermal Model of a Thinned-Die Cooling System

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only