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Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag. June 2023, 145(2): 021003.

Paper No: EP-22-1036

DOI: https://doi.org/10.1115/1.4055125

Published Online: August 18, 2022

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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis

J. Electron. Packag. March 2022, 144(1): 011003.

Paper No: EP-20-1083

DOI: https://doi.org/10.1115/1.4050696

Published Online: August 6, 2021

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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis

Journal Articles

Study of Electromigration-Induced Stress of Solder

Fei Su, Zheng Zhang, Yuan Wang, Weijia Li

J. Electron. Packag. June 2015, 137(2): 021006.

Paper No: EP-14-1025

DOI: https://doi.org/10.1115/1.4029463

Published Online: June 1, 2015

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Topics: Deformation, Electrodiffusion, Finite element methods, Solders, Stress

Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

J. Electron. Packag. June 2012, 134(2): 020903.

DOI: https://doi.org/10.1115/1.4006515

Published Online: June 11, 2012

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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration

Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004.

DOI: https://doi.org/10.1115/1.4005289

Published Online: December 9, 2011

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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Journal Articles

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Paolo Emilio Bagnoli, Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli

J. Electron. Packag. March 2011, 133(1): 011005.

DOI: https://doi.org/10.1115/1.4003516

Published Online: March 9, 2011

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Topics: Finite element methods, Stress, Temperature, Thermomechanics, Finite element analysis, Thermal analysis

Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards

J. Electron. Packag. March 2010, 132(1): 011005.

DOI: https://doi.org/10.1115/1.4000754

Published Online: March 4, 2010

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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers

Journal Articles

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

Esam M. Alawadhi

J. Electron. Packag. March 2009, 131(1): 011011.

DOI: https://doi.org/10.1115/1.3068322

Published Online: February 13, 2009

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Topics: Flow (Dynamics), Heat, Pressure drop, Reynolds number, Temperature, Thermal management, Transients (Dynamics), Steady state, Cycles, Finite element methods

Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall

J. Electron. Packag. September 2008, 130(3): 031001.

DOI: https://doi.org/10.1115/1.2957318

Published Online: July 29, 2008

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Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks

Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

J. Electron. Packag. December 2006, 128(4): 449–455.

DOI: https://doi.org/10.1115/1.2353281

Published Online: February 15, 2006

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Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties

Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183.

DOI: https://doi.org/10.1115/1.2227057

Published Online: August 7, 2005

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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip

Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag. December 2004, 126(4): 457–464.

DOI: https://doi.org/10.1115/1.1827261

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods

Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu

J. Electron. Packag. June 2004, 126(2): 195–201.

DOI: https://doi.org/10.1115/1.1648057

Published Online: July 8, 2004

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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion

Journal Articles

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve

J. Electron. Packag. December 2003, 125(4): 527–530.

DOI: https://doi.org/10.1115/1.1604154

Published Online: December 15, 2003

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Topics: Micropumps, Simulation, Finite element methods, Engineering simulation, Modeling, Membranes, Thermomechanics

Journal Articles

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort

J. Electron. Packag. December 2003, 125(4): 512–519.

DOI: https://doi.org/10.1115/1.1604152

Published Online: December 15, 2003

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Topics: Buckling, Ceramics, Copper, Delamination, Finite element methods, Finite element model, Simulation, Stress, Temperature, Deformation

Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida

J. Electron. Packag. September 2003, 125(3): 414–419.

DOI: https://doi.org/10.1115/1.1602705

Published Online: September 17, 2003

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Topics: Deflection, Temperature, Finite element methods, Plates (structures)

Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director

J. Electron. Packag. March 2003, 125(1): 134–138.

DOI: https://doi.org/10.1115/1.1535446

Published Online: March 14, 2003

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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics

Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato

J. Electron. Packag. March 2003, 125(1): 31–38.

DOI: https://doi.org/10.1115/1.1525244

Published Online: March 14, 2003

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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods

Journal Articles

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Y. T. Lin, Graduate Assistant, C. T. Peng, Graduate Assistant, K. N. Chiang, Associate Professor

J. Electron. Packag. September 2002, 124(3): 234–239.

DOI: https://doi.org/10.1115/1.1481368

Published Online: July 26, 2002

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Topics: Copper, Event history analysis, Finite element methods, Flip-chip, Packaging, Reliability, Semiconductor wafers, Solders, Wire, Finite element analysis

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Journal citation

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Supplemental Material

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Study of Electromigration-Induced Stress of Solder

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Characterization of Substrate Materials for System-in-a-Package Applications

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

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