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Journal Articles

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
https://doi.org/10.1115/1.4065805
Published Online: July 16, 2024
View Article titled, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
Open the PDF for Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling in another window
Topics: Alloys, Fatigue life, Solder joints, Solders, Temperature profiles, Ball-Grid-Array packaging, Stress, Temperature, Cycles, Fatigue
Journal Articles

Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

Chao Gao, Chunyue Huang, Liang Ying
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
https://doi.org/10.1115/1.4064097
Published Online: December 11, 2023
View Article titled, Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method
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Topics: Design, Manufacturing, Solder joints, Stress, Taguchi methods, Reliability, Fatigue life, Optimization, Ball-Grid-Array packaging
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
Open the PDF for Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life in another window
Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Article titled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
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Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
View Article titled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Article titled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Journal Articles

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011006.
Paper No: EP-20-1108
https://doi.org/10.1115/1.4050512
Published Online: August 6, 2021
View Article titled, Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment
Open the PDF for Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment in another window
Topics: Fatigue life, Random vibration, Safety, Solder joints, Ball-Grid-Array packaging
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
Open the PDF for Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds in another window
Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041001.
Paper No: EP-20-1010
https://doi.org/10.1115/1.4048109
Published Online: August 27, 2020
View Article titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
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Topics: Fatigue life, Shear (Mechanics), Stress, Fatigue, Solder joints, Cycles, Fatigue testing, Solders
Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
https://doi.org/10.1115/1.4047341
Published Online: June 23, 2020
View Article titled, Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
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Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability
Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011001.
Paper No: EP-19-1055
https://doi.org/10.1115/1.4047227
Published Online: June 4, 2020
View Article titled, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
Open the PDF for A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages in another window
Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model
Journal Articles

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011007.
Paper No: EP-19-1042
https://doi.org/10.1115/1.4044489
Published Online: October 10, 2019
View Article titled, Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling
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Topics: Cycles, Fatigue life, Semiconductor wafers, Simulation models, Solders, Stress, Temperature, Creep, Assembly lines, Simulation results
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Article titled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
https://doi.org/10.1115/1.4043480
Published Online: May 24, 2019
View Article titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
Open the PDF for Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test in another window
Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis
Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
https://doi.org/10.1115/1.4043405
Published Online: May 17, 2019
View Article titled, A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders
Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
https://doi.org/10.1115/1.4040297
Published Online: June 26, 2018
View Article titled, Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life
Journal Articles

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

Sinan Su, Nianjun Fu, Francy John Akkara, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
https://doi.org/10.1115/1.4040105
Published Online: May 21, 2018
View Article titled, Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
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Topics: Alloys, Fatigue life, Solder joints, Solders, Stress, Temperature, Cycles, Fatigue
Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011002.
Paper No: EP-17-1035
https://doi.org/10.1115/1.4038245
Published Online: March 2, 2018
View Article titled, Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life