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Journal Articles

Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems

Accepted Manuscript
Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: March 17, 2025
View Article titled, Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Computational fluid dynamics, Cooling systems, Simulation, Relaxation (Physics), Engineers, Modeling, Stability, Computer cooling, Density, Flat heat pipes
Journal Articles

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. December 2021, 143(4): 048001.
Paper No: EP-21-1128
https://doi.org/10.1115/1.4052403
Published Online: October 1, 2021
View Article titled, Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal
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Topics: Electronics, Engineers, Leadership, Mentoring, Packaging, Photonics
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

In Honor of Dr. M. M. Yovanovich

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
https://doi.org/10.1115/1.1568123
Published Online: June 10, 2003
View Article titled, In Honor of Dr. M. M. Yovanovich
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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Applied Probability for Engineers and Scientists

Ephraim Suhir, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1997, 119(3): 213–214.
https://doi.org/10.1115/1.2792237
Published Online: September 1, 1997
View Article titled, Applied Probability for Engineers and Scientists
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Topics: Engineers, Probability
Journal Articles

Prediction of Solder Joint Geometries in Array-Type Interconnects

S. M. Heinrich, M. Schaefer, S. A. Schroeder, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 114–121.
https://doi.org/10.1115/1.2792140
Published Online: September 1, 1996
View Article titled, Prediction of Solder Joint Geometries in Array-Type Interconnects
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Topics: Solder joints, Solders, Reliability, Shapes, Surface tension, Engineers, Fatigue, Flip-chip, Geometry, Necking
Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 433–439.
https://doi.org/10.1115/1.2909353
Published Online: December 1, 1993
View Article titled, Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers
Journal Articles

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Yi-Hsin Pao, Edward Jih, Bruce E. Artz, Larry W. Cathey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 470–472.
https://doi.org/10.1115/1.2905483
Published Online: December 1, 1992
View Article titled, A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
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Topics: Temperature, Thermal expansion, Errors, Electronic packages, Engineers, Error analysis, Finite element analysis, Finite element model, Modeling, Temperature effects
Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 279–287.
https://doi.org/10.1115/1.2904380
Published Online: December 1, 1990
View Article titled, An Investigation of the Passive Cooling of Table Model Television Receivers
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Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer
Journal Articles

Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 277–281.
https://doi.org/10.1115/1.3226547
Published Online: December 1, 1989
View Article titled, Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending
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Topics: Plates (structures), Stress, Boundary-value problems, Electronic packaging, Engineers, Equipment performance, Plate theory, Reliability, Vehicles
Journal Articles

Twist-Off Testing of Solder Joint Interconnections

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 165–171.
https://doi.org/10.1115/1.3226529
Published Online: September 1, 1989
View Article titled, Twist-Off Testing of Solder Joint Interconnections
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Topics: Solder joints, Testing, Shear (Mechanics), Die cutting, Engineers, Quality control, Reliability, Shearing (Deformation), Torque, Vehicles