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Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

Accepted Manuscript
Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: November 27, 2024
View Article titled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
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Topics: Engineering simulation, Lithium-ion batteries, Batteries, Simulation, Stress, Durability, Electronics, Operating temperature, Physics, Storage
Journal Articles

Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?

Accepted Manuscript
Mohammad Gharaibeh, James Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1080
https://doi.org/10.1115/1.4067137
Published Online: November 13, 2024
View Article titled, Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
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Topics: Solders, Tin, Engineering simulation, Simulation, Alloys, Deformation, Finite element analysis, Silver, Solder joints, Brittleness
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041102.
Paper No: EP-20-1020
https://doi.org/10.1115/1.4047226
Published Online: June 4, 2020
View Article titled, Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger
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Topics: Design, Electric vehicles, Engineering simulation, Simulation, Heat, Temperature, MOSFET transistors, Inductors, Cooling, Circuits
Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
https://doi.org/10.1115/1.4033109
Published Online: April 19, 2016
View Article titled, Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
https://doi.org/10.1115/1.4005451
Published Online: December 19, 2011
View Article titled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
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Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
https://doi.org/10.1115/1.2188953
Published Online: September 28, 2005
View Article titled, Modeling of Natural Convection in Electronic Enclosures
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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation
Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
https://doi.org/10.1115/1.1634590
Published Online: December 15, 2003
View Article titled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging
Journal Articles

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 527–530.
https://doi.org/10.1115/1.1604154
Published Online: December 15, 2003
View Article titled, Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump
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Topics: Micropumps, Simulation, Finite element methods, Engineering simulation, Modeling, Membranes, Thermomechanics
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 237–241.
https://doi.org/10.1115/1.2793846
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles
Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 138–146.
https://doi.org/10.1115/1.483146
Published Online: September 21, 1999
View Article titled, Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software
Journal Articles

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, M. Behnia, W. Nakayama, H. Matsushima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 259–266.
https://doi.org/10.1115/1.2792631
Published Online: September 1, 1998
View Article titled, Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages
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Topics: Electronic packages, Heat sinks, Impingement cooling, Optimization, Computational fluid dynamics, Design, Cooling, Dimensions, Electronic components, Engineering simulation
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Article titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation
Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 106–113.
https://doi.org/10.1115/1.2792277
Published Online: March 1, 1998
View Article titled, A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation
Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 148–156.
https://doi.org/10.1115/1.2792145
Published Online: September 1, 1996
View Article titled, Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
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Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages
Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 1–6.
https://doi.org/10.1115/1.2792121
Published Online: March 1, 1996
View Article titled, Fine Pitch Stencil Printing Process Modeling and Optimization
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Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat