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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Elias Papanicolaou, Sridhar Gopalakrishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 307–316.
https://doi.org/10.1115/1.2792110
Published Online: December 1, 1995
View Article titled, Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling
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Topics: Computer cooling, Natural convection, Convection, Heat transfer, Cooling, Dimensions, Energy conservation, Heat conduction, Heat flux, Heating
Journal Articles

Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

S. K. Patra, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 337–342.
https://doi.org/10.1115/1.2905417
Published Online: December 1, 1991
View Article titled, Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
Open the PDF for Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint in another window
Topics: Flip-chip, Modeling, Solder joints, Soldering, Solders, Energy conservation, Manufacturing, Reflow soldering, Reliability, Stress