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Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus

J. Electron. Packag. March 2015, 137(1): 011009.

Paper No: EP-14-1062

DOI: https://doi.org/10.1115/1.4028516

Published Online: October 15, 2014

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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure

Journal Articles

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

A. Kargar, B. Ghasemi, S. M. Aminossadati

J. Electron. Packag. March 2011, 133(1): 011010.

DOI: https://doi.org/10.1115/1.4003215

Published Online: March 10, 2011

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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat, Nanofluids, Electronic components, Temperature

Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia

J. Electron. Packag. June 2009, 131(2): 021011.

DOI: https://doi.org/10.1115/1.3103953

Published Online: April 3, 2009

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Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks

Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim

J. Electron. Packag. March 2007, 129(1): 90–97.

DOI: https://doi.org/10.1115/1.2429715

Published Online: April 19, 2006

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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components

Journal Articles

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Tunc Icoz, Nitin Verma, Yogesh Jaluria

J. Electron. Packag. December 2006, 128(4): 466–478.

DOI: https://doi.org/10.1115/1.2353284

Published Online: March 27, 2006

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Topics: Cooling, Design, Flow (Dynamics), Heat, Heat transfer, Optimization, Simulation, Computer simulation, Pressure drop, Cooling systems

Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

J. Electron. Packag. December 2006, 128(4): 449–455.

DOI: https://doi.org/10.1115/1.2353281

Published Online: February 15, 2006

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Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties

Journal Articles

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

Peter Rodgers, Vale´rie Eveloy, M. S. J. Hashmi

J. Electron. Packag. March 2005, 127(1): 67–75.

DOI: https://doi.org/10.1115/1.1849234

Published Online: March 21, 2005

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Junctions, Modeling, Temperature, Turbulence, Viscosity, Eddies (Fluid dynamics), Air flow

Journal Articles

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata

J. Electron. Packag. September 2004, 126(3): 317–324.

DOI: https://doi.org/10.1115/1.1772412

Published Online: October 6, 2004

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Topics: Boiling, Critical heat flux, Electronic components, Flow (Dynamics), Heat transfer, Pool boiling, Ducts, Condensers (steam plant), Heat flux, Cooling

Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni

J. Electron. Packag. December 2003, 125(4): 475–479.

DOI: https://doi.org/10.1115/1.1615796

Published Online: December 15, 2003

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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature

Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 235–243.

DOI: https://doi.org/10.1115/1.1569507

Published Online: June 10, 2003

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Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity

Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 226–234.

DOI: https://doi.org/10.1115/1.1569506

Published Online: June 10, 2003

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Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence

Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. D. Davies

J. Electron. Packag. March 2003, 125(1): 67–75.

DOI: https://doi.org/10.1115/1.1533059

Published Online: March 14, 2003

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Topics: Computational fluid dynamics, Computer simulation, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Electronic components, Printed circuit boards

Journal Articles

Factors Affecting the Operational Thermal Resistance of Electronic Components

Mark R. D. Davies, Reena Cole, John Lohan

J. Electron. Packag. September 2000, 122(3): 185–191.

DOI: https://doi.org/10.1115/1.1286101

Published Online: November 15, 1999

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Topics: Electronic components, Temperature, Thermal resistance, Junctions

Journal Articles

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

Nestor V. Queipo, Guy F. Gil

J. Electron. Packag. June 2000, 122(2): 152–159.

DOI: https://doi.org/10.1115/1.483148

Published Online: October 20, 1999

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Topics: Electrical wires, Electronic components, Failure, Genetic algorithms, Heat, Heat transfer, Optimization, Pareto optimization, Printed circuit boards, Design

Journal Articles

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

Eric Egan, Cristina H. Amon

J. Electron. Packag. June 2000, 122(2): 98–106.

DOI: https://doi.org/10.1115/1.483140

Published Online: September 15, 1999

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Topics: Computer simulation, Computers, Design, Electronics, Flat heat pipes, Heat, Polymer composites, Temperature, Thermal conductivity, Thermal management

Journal Articles

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Ephraim Suhir, Fellow ASME

J. Electron. Packag. March 2000, 122(1): 3–5.

DOI: https://doi.org/10.1115/1.483134

Published Online: August 31, 1999

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Topics: Electronic components, Oscillating frequencies, Oscillations, Printed circuit boards, Vibration, Stiffness, Resonance, Fatigue, Free vibrations

Journal Articles

Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package

H. Chai, Y. Zohar

J. Electron. Packag. June 1999, 121(2): 127–134.

DOI: https://doi.org/10.1115/1.2792668

Published Online: June 1, 1999

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Topics: Transfer molding, Wire, Flow (Dynamics), Displacement, Electronic components, Steady state, Stress, Vehicles

Journal Articles

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

L. Tang, Y. K. Joshi

J. Electron. Packag. June 1999, 121(2): 108–115.

DOI: https://doi.org/10.1115/1.2792664

Published Online: June 1, 1999

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Topics: Natural convection, Thermal analysis, Boundary-value problems, Computational fluid dynamics, Temperature, Ceramics, Electronic components, Electronic systems, Flux (Metallurgy), Heat

Journal Articles

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Ron S. Li

J. Electron. Packag. December 2001, 123(4): 394–400.

DOI: https://doi.org/10.1115/1.1372318

Published Online: May 6, 1999

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Topics: Damage, Electronic components, Failure mechanisms, Fatigue, Finite element analysis, Stress, Vibration, Design, Reliability, Random vibration

Journal Articles

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

D. Angirasa, G. P. Peterson

J. Electron. Packag. March 1999, 121(1): 1–7.

DOI: https://doi.org/10.1115/1.2792656

Published Online: March 1, 1999

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Topics: Forced convection, Heat, Reynolds number, Computer simulation, Convection, Electronic components, Flow (Dynamics), Fluid dynamics, Heat transfer, Porosity

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Journal citation

NARROW

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

A Vapotron Effect Application for Electronic Equipment Cooling

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

Factors Affecting the Operational Thermal Resistance of Electronic Components

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

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