Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress

Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion

Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles

Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling

Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development