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Journal Articles

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

Hui Xiong, Liaoxin Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041101.
Paper No: EP-19-1128
https://doi.org/10.1115/1.4047190
Published Online: June 4, 2020
View Article titled, Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study
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Topics: Design, Diffraction, Diffraction patterns, Optical elements, Lasers, Construction
Journal Articles

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
https://doi.org/10.1115/1.2912183
Published Online: May 15, 2008
View Article titled, Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
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Topics: Ball-Grid-Array packaging, Computer simulation, Deformation, Diffraction patterns, Displacement, Interferometers, Modeling, Solders, Stress, Manufacturing
Journal Articles

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 160–165.
https://doi.org/10.1115/1.2792609
Published Online: June 1, 1998
View Article titled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

A. F. Bastawros, A. S. Voloshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 303–308.
https://doi.org/10.1115/1.2904382
Published Online: December 1, 1990
View Article titled, Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry
Open the PDF for Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry in another window
Topics: Electronic packages, Interferometry, Strain measurement, Displacement, Deformation, Diffraction patterns, Microelectronic devices, Resolution (Optics), Temperature, Thermomechanics