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Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
https://doi.org/10.1115/1.4027425
Published Online: May 12, 2014
View Article titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision
Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
https://doi.org/10.1115/1.1571571
Published Online: June 10, 2003
View Article titled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
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Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature
Journal Articles

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 54–59.
https://doi.org/10.1115/1.1414135
Published Online: July 7, 2000
View Article titled, Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure
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Topics: Diffraction gratings, Fiber Bragg gratings, Fibers, Packaging, Temperature, Wavelength, Optical fiber, Deformation
Journal Articles

Mechanical Deformation in Conductive Adhesives as Measured With Electron-Beam Moire´

E. S. Drexler, J. R. Berger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 69–74.
https://doi.org/10.1115/1.2792670
Published Online: June 1, 1999
View Article titled, Mechanical Deformation in Conductive Adhesives as Measured With Electron-Beam Moire´
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Topics: Adhesives, Cathode ray oscilloscopes, Deformation, Electron beams, Shear (Mechanics), Stress, Diffraction gratings, Epoxy adhesives, Epoxy resins, Particulate matter
Journal Articles

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 160–165.
https://doi.org/10.1115/1.2792609
Published Online: June 1, 1998
View Article titled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain

V. T. Kowalski, A. S. Voloshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 177–183.
https://doi.org/10.1115/1.2905683
Published Online: September 1, 1994
View Article titled, Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain
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Topics: Interferometry, Lasers, Welded joints, Diffraction gratings, Image processing, Manufacturing, Plates (structures), Separation (Technology), Thermal stresses, Welding