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Journal Articles

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041105.
Paper No: EP-24-1033
https://doi.org/10.1115/1.4065863
Published Online: July 25, 2024
View Article titled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter
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Topics: Condensers (steam plant), Cooling systems, Fluids, Heat, Secondary cells, Stress, Temperature, Thermal resistance, Pipeline risers, Risers (Casting)
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Article titled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Article titled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041002.
Paper No: EP-19-1138
https://doi.org/10.1115/1.4048180
Published Online: September 4, 2020
View Article titled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
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Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature
Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
https://doi.org/10.1115/1.4047497
Published Online: June 26, 2020
View Article titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection
Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
https://doi.org/10.1115/1.4044129
Published Online: July 12, 2019
View Article titled, Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment
Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
https://doi.org/10.1115/1.4039706
Published Online: May 9, 2018
View Article titled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
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Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection
Journal Articles

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
https://doi.org/10.1115/1.4039137
Published Online: May 9, 2018
View Article titled, Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling systems, Data centers, Failure, Temperature, Cooling, Flow (Dynamics), Coolants
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Journal Articles

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

Tianyi Gao, Bahgat Sammakia, Emad Samadiani, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021007.
Paper No: EP-14-1041
https://doi.org/10.1115/1.4029163
Published Online: June 1, 2015
View Article titled, Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers
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Topics: Cooling, Data centers, Doors, Failure, Heat exchangers, Steady state, Temperature, Water, Cooling systems, Air flow
Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
https://doi.org/10.1115/1.4027509
Published Online: May 12, 2014
View Article titled, A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems
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Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)
Journal Articles

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Satish G. Kandlikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
https://doi.org/10.1115/1.4027175
Published Online: April 29, 2014
View Article titled, Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
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Topics: Cooling, Cooling systems, Design, Flow (Dynamics), Heat, Microchannels, Pressure drop, Computer cooling, Temperature, Coolants
Journal Articles

Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach

Yubai Li, Dongzhi Guo, Shi-Chune Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021002.
Paper No: EP-13-1053
https://doi.org/10.1115/1.4027174
Published Online: April 29, 2014
View Article titled, Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach
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Topics: Cooling, Design, Microchannels, Cooling systems
Journal Articles

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011010.
Paper No: EP-13-1054
https://doi.org/10.1115/1.4026536
Published Online: February 14, 2014
View Article titled, Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
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Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure
Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
https://doi.org/10.1115/1.4024590
Published Online: July 24, 2013
View Article titled, Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state
Journal Articles

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020906.
https://doi.org/10.1115/1.4006140
Published Online: June 11, 2012
View Article titled, An Overview of the IBM Power 775 Supercomputer Water Cooling System
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Topics: Cooling systems, Water, Heat, Cooling, Electronics, Manufacturing
Journal Articles

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
https://doi.org/10.1115/1.4004847
Published Online: September 14, 2011
View Article titled, Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
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Topics: Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software