Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 95

2 3 4 5

Sort by

Sort Order Select

Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

View Article

Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi

J. Electron. Packag. June 2023, 145(2): 021004.

Paper No: EP-22-1038

DOI: https://doi.org/10.1115/1.4055094

Published Online: August 18, 2022

View Article

Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

View Article

Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2021

View Article

Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira

J. Electron. Packag. March 2022, 144(1): 011011.

Paper No: EP-21-1002

DOI: https://doi.org/10.1115/1.4050981

Published Online: August 6, 2021

View Article

Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids

Journal Articles

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Sanket Girhe, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya

J. Electron. Packag. June 2021, 143(2): 021004.

Paper No: EP-20-1046

DOI: https://doi.org/10.1115/1.4048036

Published Online: September 3, 2020

View Article

Topics: Computer simulation, Flow (Dynamics), Pressure, Rotors, Porous materials, Simulation, Modeling

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

View Article

Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

View Article

Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008.

Paper No: EP-18-1108

DOI: https://doi.org/10.1115/1.4043482

Published Online: May 17, 2019

View Article

Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms

Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

J. Electron. Packag. March 2017, 139(1): 011004.

Paper No: EP-16-1075

DOI: https://doi.org/10.1115/1.4035178

Published Online: December 29, 2016

View Article

Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement

Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Thomas H. Sherer, II, Yogendra Joshi

J. Electron. Packag. September 2016, 138(3): 031008.

Paper No: EP-16-1014

DOI: https://doi.org/10.1115/1.4034101

Published Online: July 28, 2016

View Article

Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage

Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo

J. Electron. Packag. June 2016, 138(2): 021003.

Paper No: EP-15-1057

DOI: https://doi.org/10.1115/1.4033165

Published Online: April 19, 2016

View Article

Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids

Journal Articles

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

K.-C. Liao, H.-L. Lu

J. Electron. Packag. September 2015, 137(3): 031012.

Paper No: EP-15-1034

DOI: https://doi.org/10.1115/1.4030803

Published Online: September 1, 2015

View Article

Topics: Computer simulation, Molten salt reactors, Temperature, Temperature distribution

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

View Article

Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

K. Pramod, A. K. Sen

J. Electron. Packag. September 2014, 136(3): 031012.

Paper No: EP-13-1137

DOI: https://doi.org/10.1115/1.4027657

Published Online: June 5, 2014

View Article

Topics: Electroosmosis, Flow (Dynamics), Micropumps, Pressure, Temperature, Cascades (Fluid dynamics), Design, Cooling, Heat transfer, Pumps

Journal Articles

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Jason Stafford, Florian Fortune

J. Electron. Packag. March 2014, 136(1): 011008.

Paper No: EP-13-1025

DOI: https://doi.org/10.1115/1.4026351

Published Online: January 24, 2014

View Article

Topics: Cooling, Design, Fans, Flow (Dynamics), Heat sinks, Heat transfer, Thermal resistance, Computer simulation, Modeling, Air flow

Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu

J. Electron. Packag. December 2013, 135(4): 041007.

Paper No: EP-13-1018

DOI: https://doi.org/10.1115/1.4025597

Published Online: November 5, 2013

View Article

Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods

Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi

J. Electron. Packag. September 2013, 135(3): 030904.

Paper No: EP-12-1092

DOI: https://doi.org/10.1115/1.4024944

Published Online: July 24, 2013

View Article

Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty

Journal Articles

Statistical Manufacturing Model of Printing Technology

Nam-Soo Kim, Sarah Luna, Jung-Hyou Lee, Tae-Eui Jeong

J. Electron. Packag. March 2013, 135(1): 011004.

Paper No: EP-12-1005

DOI: https://doi.org/10.1115/1.4007450

Published Online: February 26, 2013

View Article

Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Printing, Computer simulation, Manufacturing, Inks, Particle size

Journal Articles

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

Qifei Jian, Qiaoli Wang, Haoting Wang, Zheng Zuo

J. Electron. Packag. March 2012, 134(1): 011006.

DOI: https://doi.org/10.1115/1.4005912

Published Online: March 19, 2012

View Article

Topics: Air flow, Data centers, Diffusers, Temperature, Computational fluid dynamics, Computer simulation

2 3 4 5

Journal citation

NARROW

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Special Section on InterPACK 2013

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Statistical Manufacturing Model of Printing Technology

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only