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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain

J. Electron. Packag. June 2021, 143(2): 020901.

Paper No: EP-20-1058

DOI: https://doi.org/10.1115/1.4049291

Published Online: February 22, 2021

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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits

Journal Articles

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon

J. Electron. Packag. December 2020, 142(4): 041102.

Paper No: EP-20-1020

DOI: https://doi.org/10.1115/1.4047226

Published Online: June 4, 2020

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Topics: Design, Electric vehicles, Engineering simulation, Simulation, Heat, Temperature, MOSFET transistors, Inductors, Cooling, Circuits

Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107.

Paper No: EP-19-1129

DOI: https://doi.org/10.1115/1.4046849

Published Online: April 24, 2020

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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density

Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

J. Electron. Packag. September 2019, 141(3): 031010.

Paper No: EP-18-1096

DOI: https://doi.org/10.1115/1.4043479

Published Online: May 24, 2019

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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering

Journal Articles

Simultaneous Optimization of an Array of Heat Sinks

Georgios Karamanis, Marc Hodes

J. Electron. Packag. June 2019, 141(2): 021001.

Paper No: EP-18-1068

DOI: https://doi.org/10.1115/1.4042668

Published Online: February 25, 2019

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat sinks, Optimization, Circuits, Coolants, Modeling

Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel

J. Electron. Packag. September 2018, 140(3): 031001.

Paper No: EP-17-1046

DOI: https://doi.org/10.1115/1.4039790

Published Online: May 10, 2018

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Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness

Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama

J. Electron. Packag. March 2017, 139(1): 010801.

Paper No: EP-16-1092

DOI: https://doi.org/10.1115/1.4035019

Published Online: November 23, 2016

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Topics: Circuits, Computers, Printed circuit boards, Hardware

Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno

J. Electron. Packag. June 2012, 134(2): 021007.

DOI: https://doi.org/10.1115/1.4005905

Published Online: June 11, 2012

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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks

Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos

J. Electron. Packag. December 2011, 133(4): 041011.

DOI: https://doi.org/10.1115/1.4005298

Published Online: December 9, 2011

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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

Journal Articles

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Eduardo Nogueira, Manuel Vázquez, Carlos Algora

J. Electron. Packag. September 2011, 133(3): 034501.

DOI: https://doi.org/10.1115/1.4004659

Published Online: September 14, 2011

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Topics: Epoxy adhesives, Epoxy resins, Failure, Light-emitting diodes, Temperature, Circuits

Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng

J. Electron. Packag. March 2011, 133(1): 011008.

DOI: https://doi.org/10.1115/1.4003214

Published Online: March 10, 2011

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Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)

Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh

J. Electron. Packag. June 2010, 132(2): 021003.

DOI: https://doi.org/10.1115/1.4001687

Published Online: June 11, 2010

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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips

Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang

J. Electron. Packag. March 2010, 132(1): 016501.

DOI: https://doi.org/10.1115/1.4000755

Published Online: March 19, 2010

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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing

Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee

J. Electron. Packag. December 2008, 130(4): 044501.

DOI: https://doi.org/10.1115/1.2993140

Published Online: November 17, 2008

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Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides

Journal Articles

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Marc Hodes, Cristian Bolle, Paul Kolodner

J. Electron. Packag. June 2007, 129(2): 216–218.

DOI: https://doi.org/10.1115/1.2721095

Published Online: September 5, 2006

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Topics: Circuits, Cooling, Gaskets, Heat sinks, Fins, Electromagnetic interference, Stress, Air flow, Flow (Dynamics)

Journal Articles

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

Bivragh Majeed, Kieran Delaney, John Barton, Niall McCarthy, Sean C. O’Mathuna, John Alderman

J. Electron. Packag. September 2006, 128(3): 236–245.

DOI: https://doi.org/10.1115/1.2229221

Published Online: November 24, 2005

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Topics: Circuits, Copper, Manufacturing, Packaging, Polymers, Semiconductor wafers, Stiffness, Stress, Wireless sensor networks, Lasers

Journal Articles

The Moulded Electronic Package (MEP)

David J. J. Lowrie

J. Electron. Packag. March 2004, 126(1): 34–36.

DOI: https://doi.org/10.1115/1.1646424

Published Online: April 30, 2004

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Topics: Electronic packages, Circuits

Journal citation

NARROW

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Simultaneous Optimization of an Array of Heat Sinks

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

Mechanical Design of Electronic Systems

Flip-Chip Interconnect for Coplanar Strip Lines

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

The Moulded Electronic Package (MEP)

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