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Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
https://doi.org/10.1115/1.4046620
Published Online: April 6, 2020
View Article titled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
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Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation
Journal Articles

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011010.
Paper No: EP-13-1054
https://doi.org/10.1115/1.4026536
Published Online: February 14, 2014
View Article titled, Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
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Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure
Journal Articles

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
https://doi.org/10.1115/1.4024302
Published Online: July 24, 2013
View Article titled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
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Topics: Buoyancy, Computational fluid dynamics, Data centers, Flow (Dynamics), Temperature, Vortices, Server racks, Approximation
Journal Articles

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031003.
Paper No: EP-12-1098
https://doi.org/10.1115/1.4024392
Published Online: June 4, 2013
View Article titled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Particulate matter, Thermal conductivity, Electrical conductance, Network models, Approximation
Journal Articles

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Yen-Shu Chen, Kuo-Hsiang Chien, Yung-Shin Tseng, Yea-Kuang Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
https://doi.org/10.1115/1.3068299
Published Online: February 11, 2009
View Article titled, Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
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Topics: Approximation, Heat, Heat sinks, Plates (structures), Thermal conductivity, Thermal resistance, Temperature distribution, Heat conduction, Design
Journal Articles

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

J. Cepeda-Rizo, Hsien-Yang Yeh, N. Teneketges
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 178–184.
https://doi.org/10.1115/1.1898339
Published Online: September 30, 2004
View Article titled, Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects
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Topics: Laminates, Printed circuit boards, Warping, Approximation, Sensors, Pressure, Displacement, Stress
Journal Articles

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

M. M. Yovanovich, Distinguished Professor Emeritus, Principal Scientific Advisor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 169–177.
https://doi.org/10.1115/1.1568124
Published Online: June 10, 2003
View Article titled, Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling
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Topics: Circular cylinders, Cooling, Cylinders, Disks, Heat flux, Temperature, Boundary-value problems, Thermal resistance, Approximation
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

A. J. Scholand, R. E. Fulton, B. Bras
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 31–36.
https://doi.org/10.1115/1.2792658
Published Online: March 1, 1999
View Article titled, An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
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Topics: Fatigue life, Genetic algorithms, Printed circuit boards, Algorithms, Approximation, Design, Energy consumption, Epoxy adhesives, Epoxy resins, Fatigue
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Article titled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
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Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Maximizing Solder Joint Reliability Through Optimal Shape Design

A. M. Deshpande, G. Subbarayan, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 149–155.
https://doi.org/10.1115/1.2792227
Published Online: September 1, 1997
View Article titled, Maximizing Solder Joint Reliability Through Optimal Shape Design
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Topics: Reliability, Shape optimization, Solder joints, Optimization, Approximation, Design, Electronic packages, Fatigue life, Artificial neural networks, Ball-Grid-Array packaging
Journal Articles

Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

Timothy S. Fisher, F. A. Zell, Kamal K. Sikka, Kenneth E. Torrance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 271–279.
https://doi.org/10.1115/1.2792163
Published Online: December 1, 1996
View Article titled, Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem
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Topics: Approximation, Heat transfer, Cooling, Thermal resistance, Computation, Finite element analysis, Heat
Journal Articles

A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach

S. Verma, A. Dasgupta, D. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 416–423.
https://doi.org/10.1115/1.2909351
Published Online: December 1, 1993
View Article titled, A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach
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Topics: Fatigue life, Solder joints, Stress, Cycles, Manufacturing, Solders, Temperature, Approximation, Creep, Design
Journal Articles

Guidelines for the Use of Approximations in Shock Response Analysis of Electronic Assemblies

R. F. Keltie, K. J. Falter
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 124–130.
https://doi.org/10.1115/1.2909292
Published Online: March 1, 1993
View Article titled, Guidelines for the Use of Approximations in Shock Response Analysis of Electronic Assemblies
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Topics: Approximation, Shock (Mechanics), Boundary-value problems, Computers, Finite element analysis, Stiffness
Journal Articles

Reliable Ceramic Window Design for Electronic Devices

Hsien-Yang Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 349–352.
https://doi.org/10.1115/1.2905462
Published Online: September 1, 1992
View Article titled, Reliable Ceramic Window Design for Electronic Devices
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Topics: Ceramics, Design, Fracture (Materials), Vacuum, Leakage, Traveling waves, Approximation, Fracture mechanics, Heating, Plates (structures)
Journal Articles

The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards

J. M. Pitarresi, D. V. Caletka, R. Caldwell, D. E. Smith
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 250–257.
https://doi.org/10.1115/1.2905403
Published Online: September 1, 1991
View Article titled, The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards
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Topics: Approximation, Boundary-value problems, Circuits, Finite element analysis, Finite element model, Mechanical properties, Modal assurance criterion, Mode shapes, Printed circuit boards, Surface mount technology
Journal Articles

Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach

D. Barker, J. Vodzak, A. Dasgupta, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 129–134.
https://doi.org/10.1115/1.2904353
Published Online: June 1, 1990
View Article titled, Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
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Topics: Fatigue, Solder joints, Cycles, Stress, Fatigue life, Reliability, Solders, Approximation, Damage, Failure
Journal Articles

Approximating the Steiner Tree in the Placement Process

Yeun Tsun Wong, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 228–235.
https://doi.org/10.1115/1.3226538
Published Online: September 1, 1989
View Article titled, Approximating the Steiner Tree in the Placement Process
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Topics: Approximation, Errors, Printed circuit boards