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Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
https://doi.org/10.1115/1.4065649
Published Online: June 20, 2024
View Article titled, Acoustic Characterization of Integrated Circuits During Operation
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Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems
Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Article titled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Open the PDF for Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation in another window
Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
https://doi.org/10.1115/1.1533802
Published Online: March 14, 2003
View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies
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Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
View Article titled, Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
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Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 225–232.
https://doi.org/10.1115/1.2909322
Published Online: September 1, 1993
View Article titled, Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
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Topics: Adhesion, Acoustics, Cracking (Materials), Deformation, Delamination, Design, Epoxy adhesives, Epoxy resins, Fatigue failure, Finite element analysis
Journal Articles

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
View Article titled, Advances in Bonding Technology for Electronic Packaging
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Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering
Journal Articles

A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

T. Hattori, S. Sakata, G. Murakami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 243–248.
https://doi.org/10.1115/1.3226542
Published Online: December 1, 1989
View Article titled, A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices
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Topics: Reliability, Stress singularity, Adhesives, Stress, Acoustics, Alloys, Bonding, Delamination, Displacement, Epoxy adhesives