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Issues
March 2021
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
J. Electron. Packag. March 2021, 143(1): 010801.
doi: https://doi.org/10.1115/1.4047414
Topics:
Heat
,
Metamaterials
,
Thermal management
,
Cooling
,
Temperature
,
Thermal conductivity
,
Electronic packaging
,
Design
,
Packaging
,
Anisotropy
Research Papers
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
J. Electron. Packag. March 2021, 143(1): 011001.
doi: https://doi.org/10.1115/1.4047227
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
J. Electron. Packag. March 2021, 143(1): 011002.
doi: https://doi.org/10.1115/1.4047228
Topics:
Delamination
,
Inspection
,
Sealants
,
Signals
,
Waves
,
Nondestructive evaluation
,
Excitation
,
Integrated circuits
Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
J. Electron. Packag. March 2021, 143(1): 011003.
doi: https://doi.org/10.1115/1.4046762
Topics:
Energy dissipation
,
Heat
,
Light-emitting diodes
,
Optimization
,
Phosphors
,
Temperature
,
Junctions
,
Natural convection
,
Thermal analysis
,
Fins
Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging
J. Electron. Packag. March 2021, 143(1): 011004.
doi: https://doi.org/10.1115/1.4047338
Topics:
Adhesion
,
Copper
,
Flux (Metallurgy)
,
Shear (Mechanics)
An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer
J. Electron. Packag. March 2021, 143(1): 011005.
doi: https://doi.org/10.1115/1.4046847
Topics:
Design
,
Graphics processing units
,
Manufacturing
,
Water
,
Flow (Dynamics)
,
Testing
,
Cooling
Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
J. Electron. Packag. March 2021, 143(1): 011006.
doi: https://doi.org/10.1115/1.4046756
Topics:
Heat flux
,
Heat sinks
,
Metal foams
,
Heat transfer
,
Temperature
,
Fluids
An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path
J. Electron. Packag. March 2021, 143(1): 011007.
doi: https://doi.org/10.1115/1.4047381
Topics:
Domes (Structural elements)
,
Heat
,
Junctions
,
Light-emitting diodes
,
Temperature
,
Currents
,
Imaging
,
Temperature measurement
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
J. Electron. Packag. March 2021, 143(1): 011008.
doi: https://doi.org/10.1115/1.4047341
Topics:
Alloys
,
Fatigue
,
Fatigue life
,
Solder joints
,
Solders
,
Stress
,
Cycles
,
Energy dissipation
,
Fatigue properties
,
Reliability
Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound
J. Electron. Packag. March 2021, 143(1): 011009.
doi: https://doi.org/10.1115/1.4047475
Topics:
Epoxy resins
,
Glass transition
,
High temperature
,
Molding
,
Storage
,
Temperature
,
Epoxy adhesives
Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems
J. Electron. Packag. March 2021, 143(1): 011010.
doi: https://doi.org/10.1115/1.4047576
Topics:
Design
,
Heat pipes
,
Optimization
,
Vapors
,
Flat heat pipes
,
Temperature
,
Condensers (steam plant)
,
Computational fluid dynamics
,
Heat
,
Satellites
Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
J. Electron. Packag. March 2021, 143(1): 011011.
doi: https://doi.org/10.1115/1.4047577
Technical Brief
A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel
J. Electron. Packag. March 2021, 143(1): 014501.
doi: https://doi.org/10.1115/1.4046755
Topics:
Boiling
,
Flow (Dynamics)
,
Fluids
,
Heat transfer
,
Microchannels
,
Subcooling
,
Water
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