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Volume 142, Issue 2

June 2020

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Editorial
Research Papers
Technical Brief

Editorial

Reviewer’s Recognition

J. Electron. Packag. June 2020, 142(2): 020201. doi: https://doi.org/10.1115/1.4046542

Extract

View articletitled, Reviewer’s Recognition

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Research Papers

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021001. doi: https://doi.org/10.1115/1.4045706

Abstract

View articletitled, Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

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Topics: Failure , Fracture (Materials) , Fracture (Process) , Delamination , Cantilevers

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. June 2020, 142(2): 021002. doi: https://doi.org/10.1115/1.4045362

Abstract

View articletitled, Investigation of Strip Warpage Behavior in Wire Bonding Process

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Topics: Strips , Temperature , Warping , Molding , Assembly lines

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

Si Yu, Zhen Wang, Jiajie Fan, Cheng Qian, Zhentao Deng, Dayong Gui

J. Electron. Packag. June 2020, 142(2): 021003. doi: https://doi.org/10.1115/1.4045568

Abstract

View articletitled, High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

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Topics: High temperature , Silicones , Titanium

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo

J. Electron. Packag. June 2020, 142(2): 021004. doi: https://doi.org/10.1115/1.4045980

Abstract

View articletitled, Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

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Topics: Elastic moduli , Intermetallic compounds , Temperature , Tin , Nanoindentation

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005. doi: https://doi.org/10.1115/1.4046164

Abstract

View articletitled, Atomic Study on Copper–Copper Bonding Using Nanoparticles

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Topics: Atoms , Bonding , Copper , Metals , Nanoparticles , Pressure , Temperature , Deformation , External pressure

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li

J. Electron. Packag. June 2020, 142(2): 021006. doi: https://doi.org/10.1115/1.4046341

Abstract

View articletitled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

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Topics: Bonding , Temperature , Temperature profiles , Tin , Solders , Low temperature , Pressure , Shear strength , Heat , Melting

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021007. doi: https://doi.org/10.1115/1.4046163

Abstract

View articletitled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

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Topics: Carbon , Electronics , Finite element analysis , Polymers , Strips , Simulation , Textiles , Mechanical properties

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. June 2020, 142(2): 021008. doi: https://doi.org/10.1115/1.4046555

Abstract

View articletitled, Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

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Topics: Ball-Grid-Array packaging , Epoxy resins , Failure , Fatigue , Finite element analysis , Printed circuit boards , Cycles , Fatigue failure

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi

J. Electron. Packag. June 2020, 142(2): 021009. doi: https://doi.org/10.1115/1.4046554

Abstract

View articletitled, Predictive Model Development and Validation for Raised Floor Plenum Data Center

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Topics: Computational fluid dynamics , Data centers , Temperature , Testing , Transients (Dynamics) , Heat , Stress

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

Meriem Akin, Jennifer Blackburn, Autumn Pratt, Andreas Dietzel

J. Electron. Packag. June 2020, 142(2): 021010. doi: https://doi.org/10.1115/1.4046557

Abstract

View articletitled, Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

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Topics: Chain , Joining , Sensors

Lifetime Model for the Fatigue Fracture in Cu/Al₂O₃/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Patrick Gaiser, Markus Klingler, Jürgen Wilde

J. Electron. Packag. June 2020, 142(2): 021011. doi: https://doi.org/10.1115/1.4046619

Abstract

View articletitled, Lifetime Model for the Fatigue Fracture in Cu/Al<sub>2</sub>O<sub>3</sub>/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

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Topics: Fracture (Materials) , Simulation , Cycles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi

J. Electron. Packag. June 2020, 142(2): 021012. doi: https://doi.org/10.1115/1.4046620

Abstract

View articletitled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

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Topics: Gallium nitride , Gates (Closures) , Heat , Modeling , Temperature , Heat flux , Heating , Critical heat flux , Heart failure , Approximation

Technical Brief

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Oluwaseun Awe, Jimil M. Shah, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler

J. Electron. Packag. June 2020, 142(2): 024501. doi: https://doi.org/10.1115/1.4046556

Abstract

View articletitled, Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

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Topics: Corrosion , Data centers , Temperature , Contamination , Failure , Reliability

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Editorial

Reviewer’s Recognition

Research Papers

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

Investigation of Strip Warpage Behavior in Wire Bonding Process

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

Lifetime Model for the Fatigue Fracture in Cu/Al₂O₃/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Technical Brief

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

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