Topics: Bonding , Fatigue life , Finite element methods , Flip-chip , Flip-chip devices , Solder joints , Solders , Thermal stresses , Dimensions , Finite element analysis

Reliability Analysis of Flip Chip Designs Via Computer Simulation

Hua Lu, C. Bailey, M. Cross

J. Electron. Packag. September 2000, 122(3): 214–219. doi: https://doi.org/10.1115/1.1286122

Abstract

View articletitled, Reliability Analysis of Flip Chip Designs Via Computer Simulation

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Topics: Computer simulation , Fatigue , Flip-chip , Flip-chip devices , Geometry , Materials properties , Reliability , Solder joints , Solders , Young's modulus

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu, G. Fu

J. Electron. Packag. September 2000, 122(3): 220–226. doi: https://doi.org/10.1115/1.1286100

Abstract

View articletitled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

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Topics: Damage , Fracture (Materials) , Nucleation (Physics) , Stress , Cycles , Microscale devices

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han, Mem. ASME

J. Electron. Packag. September 2000, 122(3): 227–232. doi: https://doi.org/10.1115/1.1286315

Abstract

View articletitled, Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

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Topics: Interferometry , Surface roughness , Warping , Microelectronic devices

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,

J. Electron. Packag. September 2000, 122(3): 233–239. doi: https://doi.org/10.1115/1.1287928

Abstract

View articletitled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

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Topics: Boundary-value problems , Cavities , Electronic packages , Fourier series , Multi-chip modules , Temperature , Thermal characterization , Laplace equations , Modeling , Junctions

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu

J. Electron. Packag. September 2000, 122(3): 240–246. doi: https://doi.org/10.1115/1.1289761

Abstract

View articletitled, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

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Topics: Cooling , Heat sinks , Optimization , Pins (Engineering) , Pressure drop , Thermal resistance , Impingement cooling , Flow (Dynamics) , Fins , Flow visualization

LGA Connectors: An Automated Design Technique for a Shrinking Design Space

A. Deshpande, G. Subbarayan

J. Electron. Packag. September 2000, 122(3): 247–254. doi: https://doi.org/10.1115/1.1286021

Abstract

View articletitled, LGA Connectors: An Automated Design Technique for a Shrinking Design Space

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Topics: Design , Optimization , Shapes , Stress , Finite element analysis , B-splines

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

John H. L. Pang, C. W. Seetoh, Z. P. Wang

J. Electron. Packag. September 2000, 122(3): 255–261. doi: https://doi.org/10.1115/1.1286120

Abstract

View articletitled, CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

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Topics: Creep , Finite element analysis , Solder joints , Temperature , Stress , Solders

A Study of Process-Induced Residual Stress in PBGA Packages

Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME

J. Electron. Packag. September 2000, 122(3): 262–266. doi: https://doi.org/10.1115/1.1285983

Abstract

View articletitled, A Study of Process-Induced Residual Stress in PBGA Packages

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Topics: Calibration , Displacement , Stress , Residual stresses , Interferometry

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

C. Y. Hui, H. D. Conway, Y. Y. Lin

J. Electron. Packag. September 2000, 122(3): 267–273. doi: https://doi.org/10.1115/1.1287930

Abstract

View articletitled, A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

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Topics: Stress , Thin films , Fracture (Materials) , Composite materials , Residual stresses , Deformation

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

C. Cui, X. Y. Huang, C. Y. Liu

J. Electron. Packag. September 2000, 122(3): 274–278. doi: https://doi.org/10.1115/1.1287929

Abstract

View articletitled, The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

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Topics: Heat , Heat transfer , Permeability , Porous materials , Temperature , Flow (Dynamics) , Heat flux , Heat sinks

Technical Briefs

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Boris Mirman

J. Electron. Packag. September 2000, 122(3): 279–280. doi: https://doi.org/10.1115/1.1286105

Abstract

View articletitled, Lead-On-Chip <em>Versus</em> Chip-On-Lead Packages and Solder Failure Criteria

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Topics: Failure , Reliability , Solders , Stress , Molding , Solder joints , Thermal stresses , Integrated circuits , Failure analysis , Integrated circuit packaging

Tools for Stress Analysis of Microelectronic Structures

Boris Mirman

J. Electron. Packag. September 2000, 122(3): 280–282. doi: https://doi.org/10.1115/1.1286104

Abstract

View articletitled, Tools for Stress Analysis of Microelectronic Structures

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Topics: Stress analysis (Engineering)

Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement

Luis A. Brignoni, Suresh V. Garimella, Mem ASME, Associate Professor,

J. Electron. Packag. September 2000, 122(3): 282–285. doi: https://doi.org/10.1115/1.1286106

Abstract

View articletitled, Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement

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Topics: Air jets , Heat sinks , Heat transfer , Nozzles , Suction , Thermal resistance , Flow (Dynamics) , Heat transfer coefficients , Reynolds number

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Reliability Analysis of Flip Chip Designs Via Computer Simulation

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

LGA Connectors: An Automated Design Technique for a Shrinking Design Space

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

A Study of Process-Induced Residual Stress in PBGA Packages

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

Technical Briefs

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Tools for Stress Analysis of Microelectronic Structures

Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement

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