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Issues
June 1998
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Preface
Special Section on Manufacturing for the Electronics Industry
J. Electron. Packag. June 1998, 120(2): 117.
doi: https://doi.org/10.1115/1.2792587
Topics:
Electronics
,
Manufacturing
Special Section Technical Papers
CBGA Solder Fillet Shape Prediction and Design Optimization
J. Electron. Packag. June 1998, 120(2): 118–122.
doi: https://doi.org/10.1115/1.2792592
Topics:
Design
,
Optimization
,
Shapes
,
Solders
,
Reliability
,
Fatigue life
,
Ball-Grid-Array packaging
,
Ceramics
,
Composite materials
,
Engineering simulation
Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
J. Electron. Packag. June 1998, 120(2): 123–128.
doi: https://doi.org/10.1115/1.2792595
Topics:
Modeling
,
Semiconductor wafers
,
Stress
,
Wire
,
Particulate matter
,
Cutting
,
Silicon
,
Abrasives
,
Fracture (Materials)
,
Slurries
An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages
J. Electron. Packag. June 1998, 120(2): 129–134.
doi: https://doi.org/10.1115/1.2792597
Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
J. Electron. Packag. June 1998, 120(2): 135–140.
doi: https://doi.org/10.1115/1.2792599
Topics:
Carbon
,
Computational fluid dynamics
,
Design
,
Sensors
,
Steady state
,
Transients (Dynamics)
,
Cooling
,
Cycles
,
Electrical measurement
,
Energy consumption
Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
J. Electron. Packag. June 1998, 120(2): 141–144.
doi: https://doi.org/10.1115/1.2792601
Topics:
Simulation
,
Solder joints
,
Solders
,
Geometry
,
Engineering simulation
,
Failure
,
Reliability
,
Wetting
,
Alloys
,
Computer simulation
Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
J. Electron. Packag. June 1998, 120(2): 145–149.
doi: https://doi.org/10.1115/1.2792605
Topics:
Modeling
,
Polymer films
,
Viscoelasticity
,
Viscoplasticity
,
Deformation
,
Stress
,
Chain
,
Constitutive equations
,
Drag (Fluid dynamics)
,
Temperature effects
Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
J. Electron. Packag. June 1998, 120(2): 150–155.
doi: https://doi.org/10.1115/1.2792607
A Review of Changes and Trends Affecting Military Electronics Manufacturing
J. Electron. Packag. June 1998, 120(2): 156–159.
doi: https://doi.org/10.1115/1.2792608
Topics:
Electronics
,
Manufacturing
,
Military systems
,
Defense industry
,
Aerospace industry
,
Coatings
,
Design
,
Proton exchange membranes
Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
J. Electron. Packag. June 1998, 120(2): 160–165.
doi: https://doi.org/10.1115/1.2792609
Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
J. Electron. Packag. June 1998, 120(2): 166–170.
doi: https://doi.org/10.1115/1.2792612
Topics:
Semiconductor wafers
,
Shades and shadows
,
Diffraction gratings
,
Diffraction patterns
,
Inspection
,
Resolution (Optics)
,
Warping
,
Lasers
,
Light sources
,
Probes
Investigation of the Lead-On-Chip Package’s Reliability
J. Electron. Packag. June 1998, 120(2): 171–174.
doi: https://doi.org/10.1115/1.2792613
Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
J. Electron. Packag. June 1998, 120(2): 175–178.
doi: https://doi.org/10.1115/1.2792616
Topics:
Ball-Grid-Array packaging
,
Electronic packaging
,
Shapes
,
Solder masks
,
Solder joints
,
Density
,
Energy conservation
,
Failure
,
Fatigue
,
Gravity (Force)
Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry
J. Electron. Packag. June 1998, 120(2): 179–185.
doi: https://doi.org/10.1115/1.2792617
Topics:
Creep
,
Finite element methods
,
Flip-chip packages
,
Interferometry
,
Modeling
,
Deformation
,
Displacement
,
Solders
,
Stress
,
Finite element analysis
Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications
J. Electron. Packag. June 1998, 120(2): 186–193.
doi: https://doi.org/10.1115/1.2792619
Topics:
Electronic packaging
,
Event history analysis
,
Stress
,
Reliability
,
Failure
,
Packaging
,
Cycles
,
Design
,
Electronic packages
,
Electronic products
Technical Papers
Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package
J. Electron. Packag. June 1998, 120(2): 194–200.
doi: https://doi.org/10.1115/1.2792620
Topics:
Cavities
,
Optimization
,
Wire
,
Temperature
,
Cycles
,
Finite element model
,
Simulation results
,
Stress
,
Failure mechanisms
,
Simulation
Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets
J. Electron. Packag. June 1998, 120(2): 201–206.
doi: https://doi.org/10.1115/1.2792621
Topics:
Temperature
,
Computer simulation
,
Electronics
,
Failure
,
Shades and shadows
,
Structures
Fatigue Life Estimation of Solder Joints in SMT-PGA Packages
J. Electron. Packag. June 1998, 120(2): 207–212.
doi: https://doi.org/10.1115/1.2792623
Book Review
Printed Circuits Handbook, Fourth Edition
J. Electron. Packag. June 1998, 120(2): 213–214.
doi: https://doi.org/10.1115/1.2792624
Topics:
Circuits
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