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Issues
September 1993
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
J. Electron. Packag. September 1993, 115(3): 225–232.
doi: https://doi.org/10.1115/1.2909322
Topics:
Adhesion
,
Acoustics
,
Cracking (Materials)
,
Deformation
,
Delamination
,
Design
,
Epoxy adhesives
,
Epoxy resins
,
Fatigue failure
,
Finite element analysis
Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests
J. Electron. Packag. September 1993, 115(3): 233–239.
doi: https://doi.org/10.1115/1.2909323
Topics:
Coating processes
,
Coatings
,
Electronic components
,
Yield stress
,
Circuits
,
Die cutting
,
Flow (Dynamics)
,
Shear stress
,
Shearing (Deformation)
Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter
J. Electron. Packag. September 1993, 115(3): 240–248.
doi: https://doi.org/10.1115/1.2909324
Topics:
Coating processes
,
Coatings
,
Electronic components
,
Skin
,
Yield stress
,
Die cutting
,
Disperse systems
,
Electronic circuits
,
Flow (Dynamics)
,
Shear stress
Debonding in Overmolded Integrated Circuit Packages
J. Electron. Packag. September 1993, 115(3): 249–255.
doi: https://doi.org/10.1115/1.2909325
Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils
J. Electron. Packag. September 1993, 115(3): 256–263.
doi: https://doi.org/10.1115/1.2909326
Topics:
Adhesion
,
Composite materials
,
Copper foil
,
Fillers (Materials)
,
Glass
,
Manufacturing
,
Lamination
,
Metals
,
Microelectronic packaging
,
Polymers
Time-Dependent Fracture of Polyimide Films
J. Electron. Packag. September 1993, 115(3): 264–269.
doi: https://doi.org/10.1115/1.2909327
Topics:
Fracture (Materials)
,
Stress
,
Fracture mechanics
,
Temperature
Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling
J. Electron. Packag. September 1993, 115(3): 270–275.
doi: https://doi.org/10.1115/1.2909328
Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source
J. Electron. Packag. September 1993, 115(3): 276–283.
doi: https://doi.org/10.1115/1.2909329
Topics:
Heat
,
Thin films
,
Temperature
,
Boundary-value problems
,
Computation
,
Diamond films
,
Heat conduction
,
Temperature distribution
An Integral Heat Sink for Cooling Microelectronic Components
J. Electron. Packag. September 1993, 115(3): 284–291.
doi: https://doi.org/10.1115/1.2909330
Topics:
Cooling
,
Heat sinks
,
Boiling
,
Heat
,
Silicon
,
Cavities
,
Atmospheric pressure
,
Etching
,
Flux (Metallurgy)
,
Heat transfer
Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity
J. Electron. Packag. September 1993, 115(3): 292–297.
doi: https://doi.org/10.1115/1.2909331
Topics:
Cavities
,
Flow (Dynamics)
,
Heat transfer
,
Nozzles
,
Separation (Technology)
,
Disks
,
Fluids
,
Reynolds number
,
Thermal boundary layers
An Experimental/Analytical Study of Strains in Encapsulated Assemblies
J. Electron. Packag. September 1993, 115(3): 298–304.
doi: https://doi.org/10.1115/1.2909332
Topics:
Casting
,
Epoxy adhesives
,
Epoxy resins
,
Finite element analysis
,
Hardening (Curing)
,
Metals
,
Strain gages
,
Stress
,
Temperature
,
Thermocouples
Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly
J. Electron. Packag. September 1993, 115(3): 305–311.
doi: https://doi.org/10.1115/1.2909333
Topics:
Alloys
,
Fatigue
,
Low temperature
,
Manufacturing
,
Solders
,
Bearings
,
Failure mechanisms
,
Fatigue testing
,
Solder joints
Component Rearrangement on Printed Wiring Boards to Maximize the Fundamental Natural Frequency
J. Electron. Packag. September 1993, 115(3): 312–321.
doi: https://doi.org/10.1115/1.2909334
Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
J. Electron. Packag. September 1993, 115(3): 322–328.
doi: https://doi.org/10.1115/1.2909335
Topics:
Reliability
,
Solder joints
,
Corners (Structural elements)
,
Fatigue
,
Fatigue life
,
Finite element methods
,
Solders
,
Stress
,
Thermal stresses
Finding the Constitutive Relation for a Specific Elastomer
J. Electron. Packag. September 1993, 115(3): 329–336.
doi: https://doi.org/10.1115/1.2909336
Topics:
Elastomers
,
Compression
,
Deflection
,
Deformation
,
Finite element analysis
,
Natural rubber
,
Polynomials
,
Shear (Mechanics)
,
Springs
,
Stress
Technical Briefs
Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads
J. Electron. Packag. September 1993, 115(3): 337–339.
doi: https://doi.org/10.1115/1.2909337
Topics:
Deflection
,
Fibers
,
Optical glass
,
Stress
A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards
J. Electron. Packag. September 1993, 115(3): 339–342.
doi: https://doi.org/10.1115/1.2909338
Book Reviews
Thermal Stress and Strain in Microelectronics Packaging
J. Electron. Packag. September 1993, 115(3): 343.
doi: https://doi.org/10.1115/1.2909339
Topics:
Microelectronic packaging
,
Thermal stresses
Structural Analysis of Printed Circuit Board Systems
J. Electron. Packag. September 1993, 115(3): 343–344.
doi: https://doi.org/10.1115/1.2909340
Topics:
Printed circuit boards
,
Structural analysis
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