Topics: Cooling , Vents , Natural convection , Design , Engineers , Flow (Dynamics) , Computer simulation , Electronic products , Flow visualization , Heat transfer

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring

J. Electron. Packag. December 1990, 112(4): 288–302. doi: https://doi.org/10.1115/1.2904381

Abstract

View articletitled, Strains in Aluminum-Adhesive-Ceramic Trilayers

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Topics: Adhesives , Aluminum , Ceramics , Epoxy adhesives , Epoxy resins , Elastic moduli , Temperature , Dimensions , Elastomers , Heat

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

A. F. Bastawros, A. S. Voloshin

J. Electron. Packag. December 1990, 112(4): 303–308. doi: https://doi.org/10.1115/1.2904382

Abstract

View articletitled, Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

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Topics: Electronic packages , Interferometry , Strain measurement , Displacement , Deformation , Diffraction patterns , Microelectronic devices , Resolution (Optics) , Temperature , Thermomechanics

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

F. Erdogan, P. F. Joseph

J. Electron. Packag. December 1990, 112(4): 309–316. doi: https://doi.org/10.1115/1.2904383

Abstract

View articletitled, Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

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Topics: Modeling , Stress , Fracture (Materials) , Membranes , Shear (Mechanics) , Temperature

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion

F. Erdogan, P. F. Joseph

J. Electron. Packag. December 1990, 112(4): 317–326. doi: https://doi.org/10.1115/1.2904384

View articletitled, Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion

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Topics: Modeling

Mechanical Behavior of Flip-Chip Encapsulants

E. Suhir, J. M. Segelken

J. Electron. Packag. December 1990, 112(4): 327–332. doi: https://doi.org/10.1115/1.2904385

Abstract

View articletitled, Mechanical Behavior of Flip-Chip Encapsulants

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Topics: Flip-chip , Mechanical behavior , Stress , Design , Epoxy adhesives , Epoxy resins , Silicones , Failure , Mechanical properties , Preferences

Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

D. Agonafer, D. F. Moffatt

J. Electron. Packag. December 1990, 112(4): 333–337. doi: https://doi.org/10.1115/1.2904386

Abstract

View articletitled, Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

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Topics: Computer simulation , Forced convection , Printed circuit boards , Flow (Dynamics) , Fluids , Heat transfer , Heat transfer coefficients , Reynolds number , Turbulence

Thermal Analysis of a Ceramic Package for Microelectronic Applications

H. Rajala, M. Renksizbulut

J. Electron. Packag. December 1990, 112(4): 338–344. doi: https://doi.org/10.1115/1.2904387

Abstract

View articletitled, Thermal Analysis of a Ceramic Package for Microelectronic Applications

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Topics: Ceramics , Thermal analysis , Temperature , Cavities , Forced convection , Junctions , Natural convection , Flow (Dynamics) , Heat , Heat transfer

Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant

S. M. Miner

J. Electron. Packag. December 1990, 112(4): 345–349. doi: https://doi.org/10.1115/1.2904388

Abstract

View articletitled, Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant

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Topics: Coolants , Electronic systems , Reliability , Flow (Dynamics) , Failure , Energy dissipation , Junctions , System failures , Temperature

Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

V. K. Maudgal, J. Kliman, J. Miles, J. E. Sunderland

J. Electron. Packag. December 1990, 112(4): 350–356. doi: https://doi.org/10.1115/1.2904389

Abstract

View articletitled, Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

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Topics: Heat , Manufacturing , Electrical conductance , Temperature , Aluminum foil , Pressure , Contact resistance , Geometry , Heat sinks , Steady state

The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity

A. Khalillolahi, B. Sammakia

J. Electron. Packag. December 1990, 112(4): 357–366. doi: https://doi.org/10.1115/1.2904390

Abstract

View articletitled, The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity

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Topics: Cavities , Heat capacity , Natural convection , Specific heat , Transients (Dynamics) , Flow (Dynamics) , Heat conduction , Buoyancy , Convection , Fluids

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight

J. Electron. Packag. December 1990, 112(4): 367–374. doi: https://doi.org/10.1115/1.2904391

Abstract

View articletitled, Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

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Topics: Heat , Natural convection , Water , Heat transfer , Temperature measurement , Accounting , Computation , Flow visualization , Heating , Temperature

Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

I. Mudawar, T. M. Anderson

J. Electron. Packag. December 1990, 112(4): 375–382. doi: https://doi.org/10.1115/1.2904392

Abstract

View articletitled, Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

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Topics: Coolants , Cooling systems , Density , Design , Pool boiling , Pressure , Subcooling , Boiling , Critical heat flux , Temperature

Technical Briefs

Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors

E. Suhir

J. Electron. Packag. December 1990, 112(4): 383–386. doi: https://doi.org/10.1115/1.2904393

Abstract

View articletitled, Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors

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Topics: Design , Mechanical behavior , Density , Electronic packaging , Metals

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Research Papers

An Investigation of the Passive Cooling of Table Model Television Receivers

Strains in Aluminum-Adhesive-Ceramic Trilayers

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion

Mechanical Behavior of Flip-Chip Encapsulants

Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

Thermal Analysis of a Ceramic Package for Microelectronic Applications

Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant

Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

Technical Briefs

Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors

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