Abstract
The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical and fatigue properties of the actual solder joint structure have not been studied for these new alloys. In this paper, a cyclic fatigue test was conducted on individual real solder joints of different alloys, including SnAgCu, SnCu–Bi, SnAgCu–Bi, and SnAgCu–BiSb. The fatigue property of those solder joints was analyzed based on the characteristic fatigue life and stress–strain, hysteresis, loops. The results show that solder joints with both Ag and Bi content have a better fatigue resistance than the solder joints with Ag or Bi content only. The results of SnAgCu and SnCu–Bi solder alloys show similar fatigue performance. Also, the fatigue performance of SnAgCu–Bi is close to SnAgCu–BiSb in the accelerated test. But the SnAgCu–Bi alloy is estimated to have a longer characteristic life under low-stress amplitude cycling. The microstructure analysis shows a bismuth-rich phase formed around the Ag3Sn precipitates. Adding bismuth in the solder alloy can significantly improve the fatigue properties through solid solution hardenings. On another hand, the plastic strain range and work dissipation were measured from the hysteresis loops for all tests. The Morrow Energy and the Coffin–Manson models were developed from the fitted data to predict the fatigue life as a function of work dissipation and plastic strain range.
Issue Section:
Research Papers
Topics:
Alloys,
Fatigue,
Fatigue life,
Solder joints,
Solders,
Stress,
Cycles,
Energy dissipation,
Fatigue properties,
Reliability
References
1.
Kotadia
,
H. R.
,
Howes
,
P. D.
, and
Mannan
,
S. H.
, 2014
, “
A Review: On the Development of Low Melting Temperature Pb-Free Solders
,” Microelectron. Reliab.
,
54
(6–7
), pp. 1253
–1273
.10.1016/j.microrel.2014.02.0252.
Li
,
Y.
, and
Chan
,
Y. C.
, 2015
, “
Effect of Silver (Ag) Nanoparticle Size on the Microstructure and Mechanical Properties of Sn58Bi–Ag Composite Solders
,” J. Alloys Compd.
,
645
, pp. 566
–576
.10.1016/j.jallcom.2015.05.0233.
Zhang
,
L.
, and
Tu
,
K. N.
, 2014
, “
Structure and Properties of Lead-Free Solders Bearing Micro and Nano Particles
,” Mater. Sci. Eng.
,
82
, pp. 1
–32
.10.1016/j.mser.2014.06.0014.
Zhang
,
L.
,
Xue
,
S. B.
,
Zeng
,
G.
,
Gao
,
L. L.
, and
Ye
,
H.
, 2012
, “
Interface Reaction Between SnAgCu/SnAgCuCe Solders and Cu Substrate Subjected to Thermal Cycling and Isothermal Aging
,” J. Alloys Compd.
,
510
(1
), pp. 38
–45
.10.1016/j.jallcom.2011.08.0445.
Zhang
,
L.
,
Fan
,
X.
,
He
,
C.
, and
Guo
,
Y.
, 2013
, “
Intermetallic Compound Layer Growth Between SnAgCu Solder and Cu Substrate in Electronic Packaging
,” J. Mater. Sci.
,
24
(9
), pp. 3249
–3254
.10.1007/s10854-013-1236-96.
Batiha
, F.
, Hamasha
, S.
, Jaradat
, Y.
, Wentlent
, L.
, Qasaimeh
, A.
, and Borgesen
, P.
, 2015
, “Challenges for the Prediction of Solder Joint Life in Long Term Vibration
,” IEEE 65th Electronic Components and Technology Conference (ECTC
), San Diego, CA, May 26–29, pp. 1553–1159.10.1109/ECTC.2015.71598047.
Vianco
,
P. T.
, and
Rejent
,
J. A.
, 1999
, “
Properties of Ternary Sn-Ag-Bi Solder Alloys: Part I—Thermal Properties and Microstructural Analysis
,” J. Electron. Mater.
,
28
(10
), pp. 1127
–1137
.10.1007/s11664-999-0250-48.
Mookam
,
N.
, and
Kanlayasiri
,
K.
, 2012
, “
Evolution of Intermetallic Compounds Between Sn-0.3 Ag-0.7 Cu Low-Silver Lead-Free Solder and Cu Substrate During Thermal Aging
,” J. Mater. Sci. Technol.
,
28
(1
), pp. 53
–59
.10.1016/S1005-0302(12)60023-19.
Maalekian
,
M.
,
Xu
,
Y.
, and
Seelig
,
K.
, 2015
, “
Efect of Bi Content on Properties of Low Silver SAC Solder
,” AIM Metals & Alloys Montreal
, SMTA International Conference Proceedings,
Rosemont IL, Sept. 27–Oct. 1
.http://www.circuitinsight.com/pdf/effect_bi_content_properties_smta.pdf10.
Coyle
,
R.
,
Parker
,
R.
,
Arfaei
,
B.
,
Mutuku
,
F.
,
Sweatman
,
K.
,
Howell
,
K.
,
Longgood
,
S.
, and
Benedetto
,
E.
, 2014
, “
The Effect of Nickel Microalloying on Thermal Fatigue Reliability and Microstructure of SAC105 and SAC205 Solders
,” IEEE 64th Electronic Components and Technology Conference (ECTC
), Orlando, FL, May 27–30.10.1109/ECTC.2014.689732011.
Pandher
,
R. S.
,
Lewis
,
B. G.
,
Vangaveti
,
R.
, and
Singh
,
B.
, 2007
, “
Drop Shock Reliability of Lead-Free Alloys—Effect of Micro-Additives
,” Proceedings 57th Electronic Components and Technology Conference
, Reno, NV, May 29–June 1.10.1109/ECTC.2007.37386812.
Ye
,
L.
,
Lai
,
Z. H.
,
Liu
,
J.
, and
Thölén
,
A.
, 2001
, “
Microstructure Investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B Lead‐Free Solders
,” Soldering Surf. Mount Technol.
,
13
(3
), pp. 16
–20
.10.1108/EUM000000000602513.
Shnawah
,
D. A.
,
Sabri
,
M. F. M.
, and
Badruddin
,
I. A.
, 2012
, “
The Limited Reliability of Board-Level SAC Solder Joints Under Both Mechanical and Thermo-Mechanical Loads
,” Informacije Midem
,
42
(1
), pp. 3
–10
.http://www.midem-drustvo.si/Journal%20papers/MIDEM_42(2012)1p3.pdf14.
Abdul Ameer Shnawah
,
D.
,
Faizul Bin Mohd Sabri
,
M.
,
Anjum Badruddin
,
I.
, and
Said
,
S.
, 2012
, “
A Review on Effect of Minor Alloying Elements on Thermal Cycling and Drop Impact Reliability of Low‐Ag Sn‐Ag‐Cu Solder Joints
,” Microelectron. Int.
,
29
(1
), pp. 47
–57
.10.1108/1356536121121920215.
Mahdavifard
,
M. H.
,
Sabri
,
M. F. M.
,
Shnawah
,
D. A.
,
Said
,
S. M.
,
Badruddin
,
I. A.
, and
Rozali
,
S.
, 2015
, “
The Effect of Iron and Bismuth Addition on the Microstructural, Mechanical, and Thermal Properties of Sn–1Ag–0.5Cu Solder Alloy
,” Microelectron. Reliab.
,
55
(9–10
), pp. 1886
–1890
.10.1016/j.microrel.2015.06.13416.
Shnawah
,
D. A.
,
Sabri
,
M. F. M.
,
Badruddin
,
I. A.
,
Said
,
S. B. M.
,
Ariga
,
T.
, and
Che
,
F. X.
, 2013
, “
Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing
,” J. Electron. Mater.
,
42
(3
), pp. 470
–484
.10.1007/s11664-012-2343-817.
Liu
,
W.
,
Lee
,
N.-C.
,
Porras
,
A.
,
Ding
,
M.
,
Gallagher
,
A.
,
Huang
,
A.
,
Chen
,
S.
, and
Lee
,
J. C. B.
, 2009
, “
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn or Ce Doping
,” 59th Electronic Components and Technology Conference
, San Diego, CA, May 26–29.10.1109/ECTC.2009.507413418.
Abdul‐Ameer Shnawah
,
D.
,
Faizul Mohd Sabri
,
M.
,
Anjum Badruddin
,
I.
, and
Xing Che
,
F.
, 2012
, “
The Bulk Alloy Microstructure and Tensile Properties of Sn‐1Ag‐0.5Cu‐xAl Lead‐Free Solder Alloys (x=0, 1, 1.5 and 2 wt %)
,” Microelectron. Int.
,
29
(2
), pp. 108
–116
.10.1108/1356536121123771619.
Gain
,
A. K.
,
Fouzder
,
T.
,
Chan
,
Y. C.
,
Sharif
,
A.
,
Wong
,
N. B.
, and
Yung
,
W. K. C.
, 2010
, “
The Influence of Addition of Al Nano-Particles on the Microstructure and Shear Strength of Eutectic Sn–Ag–Cu Solder on Au/Ni Metallized Cu Pads
,” J. Alloys Compd.
,
506
(1
), pp. 216
–223
.10.1016/j.jallcom.2010.06.18020.
Song
,
H. Y.
,
Zhu
,
Q. S.
,
Wang
,
Z. G.
,
Shang
,
J. K.
, and
Lu
,
M.
, 2010
, “
Effects of Zn Addition on Microstructure and Tensile Properties of Sn–1Ag–0.5Cu Alloy
,” Mater. Sci. Eng.
,
527
(6
), pp. 1343
–1350
.10.1016/j.msea.2009.10.04821.
El-Daly
,
A. A.
,
Hammad
,
A. E.
,
Al-Ganainy
,
G. S.
, and
Ragab
,
M.
, 2014
, “
Influence of Zn Addition on the Microstructure, Melt Properties and Creep Behavior of Low Ag-Content Sn–Ag–Cu Lead-Free Solders
,” Mater. Sci. Eng.
,
608
, pp. 130
–138
.10.1016/j.msea.2014.04.07022.
He
,
M.
,
Ekpenuma
,
S. N.
, and
Acoff
,
V. L.
, 2008
, “
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
,” J. Electron. Mater.
,
37
(3
), pp. 300
–306
.10.1007/s11664-007-0368-123.
Hodúlová
,
E.
,
Palcut
,
M.
,
Lechovič
,
E.
,
Šimeková
,
B.
, and
Ulrich
,
K.
, 2011
, “
Kinetics of Intermetallic Phase Formation at the Interface of Sn–Ag–Cu–X (X=Bi, in) Solders With Cu Substrate
,” J. Alloys Compd.
,
509
(25
), pp. 7052
–7059
.10.1016/j.jallcom.2011.03.16424.
Li
,
G. Y.
,
Chen
,
B. L.
,
Shi
,
X. Q.
,
Wong
,
S. C. K.
, and
Wang
,
Z. F.
, 2006
, “
Effects of Sb Addition on Tensile Strength of Sn–3.5Ag–0.7Cu Solder Alloy and Joint
,” Thin Solid Films
,
504
(1–2
), pp. 421
–425
.10.1016/j.tsf.2005.09.06025.
Zhao
,
J.
,
Qi
,
L.
,
Wang
,
X.
, and
Wang
,
L.
, 2004
, “
Influence of Bi on Microstructures Evolution and Mechanical Properties in Sn–Ag–Cu Lead-Free Solder
,” J. Alloys Compd.
,
375
(1–2
), pp. 196
–201
.10.1016/j.jallcom.2003.12.00526.
Gao
,
L.
,
Xue
,
S.
,
Zhang
,
L.
,
Sheng
,
Z.
,
Ji
,
F.
,
Dai
,
W.
,
Yu
,
S-L.
, and
Zeng
,
G.
, 2010
, “
Effect of Alloying Elements on Properties and Microstructures of SnAgCu Solders
,” Microelectron. Eng.
,
87
(11
), pp. 2025
–2034
.10.1016/j.mee.2010.04.00727.
Zhao
,
J.
,
Mutoh
,
Y.
,
Miyashita
,
Y.
, and
Mannan
,
S. L.
, 2002
, “
Fatigue Crack-Growth Behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi Lead-Free Solders
,” J. Electron. Mater.
,
31
(8
), pp. 879
–886
.10.1007/s11664-002-0199-z28.
Rizvi
,
M. J.
,
Chan
,
Y. C.
,
Bailey
,
C.
,
Lu
,
H.
, and
Islam
,
M. N.
, 2006
, “
Effect of Adding 1 wt% Bi Into the Sn–2.8Ag–0.5Cu Solder Alloy on the Intermetallic Formations With Cu-Substrate During Soldering and Isothermal Aging
,” J. Alloys Compd.
,
407
(1–2
), pp. 208
–214
.10.1016/j.jallcom.2005.06.05029.
Kanlayasiri
,
K.
, and
Kongchayasukawat
,
R.
, 2018
, “
Property Alterations of Sn-0.6Cu-0.05Ni-Ge Lead-Free Solder by Ag, Bi, in and Sb Addition
,” Trans. Nonferrous Met. Soc. China
,
28
(6
), pp. 1166
–1175
.10.1016/S1003-6326(18)64754-530.
Kariya
,
Y.
, and
Otsuka
,
M.
, 1998
, “
Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy
,” J. Electron. Mater.
,
27
(7
), pp. 866
–870
.10.1007/s11664-998-0111-631.
Kanchanomai
,
C.
,
Miyashita
,
Y.
, and
Mutoh
,
Y.
, 2002
, “
Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-Free Solders
,” J. Electron. Mater.
,
31
(5
), pp. 456
–465
.10.1007/s11664-002-0100-032.
Zhao
,
J.
,
Cheng
,
C.
,
Qi
,
L.
, and
Chi
,
C.
, 2009
, “
Kinetics of Intermetallic Compound Layers and Shear Strength in Bi-Bearing SnAgCu/Cu Soldering Couples
,” J. Alloys Compd.
,
473
(1–2
), pp. 382
–388
.10.1016/j.jallcom.2008.05.08233.
El-Daly
,
A. A.
,
El-Taher
,
A. M.
, and
Gouda
,
S.
, 2015
, “
Development of New Multicomponent Sn–Ag–Cu–Bi Lead-Free Solders for Low-Cost Commercial Electronic Assembly
,” J. Alloys Compd.
,
627
, pp. 268
–275
.10.1016/j.jallcom.2014.12.03434.
Hamasha
,
S.
,
Jaradat
,
Y.
,
Qasaimeh
,
A.
,
Obaidat
,
M.
, and
Borgesen
,
P.
, 2014
, “
Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions
,” J. Electron. Mater.
,
43
(12
), pp. 4472
–4484
.10.1007/s11664-014-3436-335.
Hamasha
,
S.
,
Wentlent
,
L.
, and
Borgesen
,
P.
, 2015
, “
Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions
,” IEEE Trans. Compon., Packaging Manuf. Technol.
,
5
(9
), pp. 1284
–1291
.10.1109/TCPMT.2015.246024436.
Su, S., Akkara, F., Abueed, M., Jian, M., Hamasha, S., Suhling, J., and Lall, P., 2018, “Fatigue Properties of Lead-Free Doped Solder Joints,” 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (
ITherm
), San Diego, CA, May 29–June 1, pp. 1243–1248.10.1109/ITHERM.2018.841956637.
Su
,
S.
,
Fu
,
N.
,
John Akkara
,
F.
, and
Hamasha
,
S.
, 2018
, “
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
,” ASME J. Electron. Packag.
,
140
(3
), p. 031005
.10.1115/1.404010538.
Hamasha
,
S.
,
Su
,
S.
,
Akkara
,
F.
,
Dawahdeh
,
A.
,
Borgesen
,
P.
, and
Qasaimeh
,
A.
, 2017
, “
Solder Joint Reliability in Isothermal Varying Load Cycling
,” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), Orlando, FL, May 30–June 2.10.1109/ITHERM.2017.799263639.
Borgesen
,
P.
,
Hamasha
,
S.
,
Obaidat
,
M.
,
Raghavan
,
V.
,
Dai
,
X.
,
Meilunas
,
M.
, and
Anselm
,
M.
, 2013
, “
Solder Joint Reliability Under Realistic Service Conditions
,” Microelectron. Reliab.
,
53
(9–11
), pp. 1587
–1591
.10.1016/j.microrel.2013.07.09140.
Hamasha
,
S.
,
Qasaimeh
,
A.
,
Jaradat
,
Y.
, and
Borgesen
,
P.
, 2015
, “
Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling
,” IEEE Trans. Compon., Packaging Manuf. Technol.
,
5
(9
), pp. 1292
–1299
.10.1109/TCPMT.2015.245398941.
Qasaimeh
,
A.
,
Hamasha
,
S.
,
Jaradat
,
Y.
, and
Borgesen
,
P.
, 2015
, “
Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
,” ASME J. Electron. Packag.
,
137
(2
), p. 021012
.10.1115/1.402944142.
Obaidat
,
M.
,
Hamasha
,
S.
,
Jaradat
,
Y.
,
Qasaimeh
,
A.
,
Arfaei
,
B.
,
Anselm
,
M.
, and
Borgesen
,
P.
, 2013
, “
Effects of Varying Amplitudes on the Fatigue Life of Lead Free Solder Joints
,” IEEE 63rd Electronic Components and Technology Conference
, Las Vegas, NV, May 28–31.10.1109/ECTC.2013.657574143.
Akkara
, F.
, Su.
, S.
, Thirugnanasambandam
, S.
, Sridhar
, S.
, Dawahdeh
, A.
, Hamasha
, S.
, Qasaimeh
, A.
, and Evans
, J.
, 2017
, “Effects of Long-Term Aging on SnAgCu Solder Joints Reliability in Mechanical Cycling Fatigue,” SMTA International Conference Proceedings (SMTAI
), Chicago, IL, Sept. 17–21.https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=503144.
Hamasha
,
S.
, and
Borgesen
,
P.
, 2016
, “
Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
,” ASME J. Electron. Packag.
,
138
(2
), p. 021002
.10.1115/1.403288145.
Morrow
,
J.
, 1965
, “
Cyclic Plastic Strain Energy and Fatigue of Metals
,” Intern. Frict., Damping, Cycl. Plast.
, B. Lazan, ed., ASTM International, West Conshohocken, PA, pp. 45
–87
.10.1520/STP43764S46.
Coffin
,
L. F.
, Jr.
, 1954
, “
A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal
,” Trans. Am. Soc. Mech. Eng.
, New York,
76
, pp. 931
–950
.https://www.osti.gov/biblio/4363016-study-effects-cyclic-thermal-stresses-ductile-metal47.
Liu
,
S.
,
McDonald
,
S.
,
Sweatman
,
K.
, and
Nogita
,
K.
, 2018
, “
The Effects of Precipitation Strengthening and Solid Solution Strengthening on Strain Rate Sensitivity of Lead-Free Solders
,” Rev. Microelectron. Reliab.
,
84
, pp. 170
–180
.10.1016/j.microrel.2018.03.038Copyright © 2021 by ASME
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