Gallium-based liquid metal (LM) inherits excellent thermophysical properties and pollution-free characteristics. However, it has long been a fatal problem that LM would cause serious corrosion and embrittlement on the classical substrate made of aluminum alloys in constructing chip cooling device. Here, anodic oxidation treatment was introduced on processing the aluminum alloy aiming to tackle the corrosion issues. The prepared anodic oxidation aluminum (AAO) coatings were composed of nanopore layers and barrier layers on a high-purity alumina matrix that were manufactured electrochemically. According to the measurement, the effective thermal conductivity of the anodized aluminum alloy increases with the total thickness of sample increasing. When the total thickness L exceeds 5 × 10−3 m, effects of the porous media on effective thermal conductivity are negligible via model simulation and calculation. It was experimentally found that aluminum alloy after surface anodization treatment presented excellent corrosion resistance and outstanding heat transfer performance even when exposed in eutectic gallium–indium (E-GaIn) LM over 200 °C. The convective heat transfer coefficient of LM for anodized sample reached the peak when the heat load is 33.3 W.
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March 2019
Research-Article
Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal
Yuntao Cui,
Yuntao Cui
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China
Search for other works by this author on:
Yujie Ding,
Yujie Ding
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Search for other works by this author on:
Shuo Xu,
Shuo Xu
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Search for other works by this author on:
Yushu Wang,
Yushu Wang
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Search for other works by this author on:
Wei Rao,
Wei Rao
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Search for other works by this author on:
Jing Liu
Jing Liu
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China;
Department of Biomedical Engineering,
School of Medicine,
Tsinghua University,
Beijing 100084, China
e-mail: jliu@mail.ipc.ac.cn
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China;
Department of Biomedical Engineering,
School of Medicine,
Tsinghua University,
Beijing 100084, China
e-mail: jliu@mail.ipc.ac.cn
Search for other works by this author on:
Yuntao Cui
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China
Yujie Ding
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Shuo Xu
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Yushu Wang
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Wei Rao
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China
Jing Liu
Key Laboratory of Cryogenics,
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China;
Department of Biomedical Engineering,
School of Medicine,
Tsinghua University,
Beijing 100084, China
e-mail: jliu@mail.ipc.ac.cn
Technical Institute of Physics and Chemistry,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Future Technology,
University of Chinese Academy of Sciences,
Beijing 100049, China;
Department of Biomedical Engineering,
School of Medicine,
Tsinghua University,
Beijing 100084, China
e-mail: jliu@mail.ipc.ac.cn
1These authors contributed equally to the paper.
2Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 16, 2018; final manuscript received October 3, 2018; published online February 25, 2019. Assoc. Editor: Baris Dogruoz.
J. Electron. Packag. Mar 2019, 141(1): 011001 (7 pages)
Published Online: February 25, 2019
Article history
Received:
March 16, 2018
Revised:
October 3, 2018
Citation
Cui, Y., Ding, Y., Xu, S., Wang, Y., Rao, W., and Liu, J. (February 25, 2019). "Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal." ASME. J. Electron. Packag. March 2019; 141(1): 011001. https://doi.org/10.1115/1.4041665
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