In the latest microelectronics industry, the emerging three-dimensional (3D) chip stacking technique using through silicon via (TSV) enables higher integration density that allows greater numbers of interconnections in order to fulfill the urgent requirements of dimensional downscaling and electrical speed enhancement. A high-density pitch of microbumps associated with the wafer-level underfill (WLUF) under a thermal compressions process are utilized to prevent the thermomechanical failures of the microbumps due to variations of thermal expansions of different materials in the 3D package. The use of dummy microbumps has been proposed to find the acceptable thin-layer uniformity and the reliable mechanical performances of the entire packaging structure. The warpage and strain behavior of packaging structure has been simulated by finite element analysis (FEA) and compared with experimental results. The responses were parametrically modeled using Kriging model with respect to compressive force, the thickness of the top chip, and the location of the dummy microbumps. The deterministic design guidance for warpage and strain has been obtained from the Kriging model. Furthermore, the reliability of the design under uncertainty has been investigated. A reliability-based design guidance (RBDG) has been proposed to provide a safety boundary in terms of the allowable reliability index. The proposed method can be utilized as the reliability standard for high-throughput production of 3D integrated circuits (ICs) packaging.
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September 2014
Research-Article
Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
Chang-Chun Lee,
Chang-Chun Lee
Department of Mechanical Engineering,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
Chung Yuan Christian University
,200 Chungpei Road
,Chungli, Taoyuan 32023
, Taiwan
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Po Ting Lin
Po Ting Lin
1
Department of Mechanical Engineering,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
e-mail: potinglin@cycu.edu.tw
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
Chung Yuan Christian University
,200 Chungpei Road
,Chungli, Taoyuan 32023
, Taiwan
e-mail: potinglin@cycu.edu.tw
1Corresponding author.
Search for other works by this author on:
Chang-Chun Lee
Department of Mechanical Engineering,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
Chung Yuan Christian University
,200 Chungpei Road
,Chungli, Taoyuan 32023
, Taiwan
Po Ting Lin
Department of Mechanical Engineering,
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
e-mail: potinglin@cycu.edu.tw
R&D Center for Microsystem Reliability,
Center for Biomedical Technology,
Chung Yuan Christian University
,200 Chungpei Road
,Chungli, Taoyuan 32023
, Taiwan
e-mail: potinglin@cycu.edu.tw
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 30, 2013; final manuscript received February 4, 2014; published online May 5, 2014. Assoc. Editor: Yi-Shao Lai.
J. Electron. Packag. Sep 2014, 136(3): 031006 (9 pages)
Published Online: May 5, 2014
Article history
Received:
October 30, 2013
Revision Received:
February 4, 2014
Citation
Lee, C., and Lin, P. T. (May 5, 2014). "Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps." ASME. J. Electron. Packag. September 2014; 136(3): 031006. https://doi.org/10.1115/1.4026854
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