A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code to estimate the strength of the unknown heat generation for an encapsulated chip in a three-dimensional irregular domain. The advantage of calling code as a subroutine in the present inverse calculation lies in that many difficult but practical 3D inverse problem can be solved under this construction since the general-purpose commercial code has the ability to solve the direct problem easily. The results obtained by using the CGM to solve this 3D inverse problem are justified based on the numerical experiments using the simulated exact and inexact measurements. It is concluded that reliable heat generation can be estimated by the present inverse algorithm.
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e-mail: chhuang@mail.ncku.edu.tw
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March 2010
Research Papers
An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip
Cheng-Hung Huang,
Cheng-Hung Huang
Professor
Department of Systems and Naval Mechatronic Engineering,
e-mail: chhuang@mail.ncku.edu.tw
National Cheng Kung University
, Tainan, Taiwan 701, R.O.C
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Wei-Lun Chang
Wei-Lun Chang
Department of Systems and Naval Mechatronic Engineering,
National Cheng Kung University
, Tainan, Taiwan 701, R.O.C
Search for other works by this author on:
Cheng-Hung Huang
Professor
Department of Systems and Naval Mechatronic Engineering,
National Cheng Kung University
, Tainan, Taiwan 701, R.O.Ce-mail: chhuang@mail.ncku.edu.tw
Wei-Lun Chang
Department of Systems and Naval Mechatronic Engineering,
National Cheng Kung University
, Tainan, Taiwan 701, R.O.CJ. Electron. Packag. Mar 2010, 132(1): 011004 (9 pages)
Published Online: March 4, 2010
Article history
Received:
August 10, 2009
Revised:
October 25, 2009
Online:
March 4, 2010
Published:
March 4, 2010
Citation
Huang, C., and Chang, W. (March 4, 2010). "An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip." ASME. J. Electron. Packag. March 2010; 132(1): 011004. https://doi.org/10.1115/1.4000720
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