While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device operating temperature. This is achieved by incorporating a microchannel heat sink as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below $55°C$ while dissipating in excess of $100W∕cm2$. It is shown that while higher heat transfer coefficients are possible with greater mass velocities, those conditions are typically associated with wet compression corresponding to evaporator exit quality below unity and liquid entrainment at the compressor inlet. Wet compression compromises compressor performance and reliability as well as refrigeration cycle efficiency and therefore must be minimized by maintaining only slightly superheated conditions at the compressor inlet, or using a wet-compression-tolerant compressor. A parametric study of the effects of channel geometry on heat sink performance points to channels with small width and high aspect ratio as yielding superior thermal performance corresponding to only a modest penalty in pressure drop.

1.
Tuckerman
,
D. B.
, and
Pease
,
R. F. W.
, 1981, “
High-performance Heat Sinking for VLSI
,”
IEEE Electron Device Lett.
0741-3106,
2
, pp.
126
129
.
2.
Bowers
,
M. B.
, and
Mudawar
,
I.
, 1994, “
High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-Channel and Micro-Channel Heat Sinks
,”
Int. J. Heat Mass Transfer
0017-9310,
37
, pp.
321
332
.
3.
Qu
,
W.
, and
Mudawar
,
I.
, 2003, “
Measurement and Prediction of Pressure Drop in Two-Phase Micro-Channel Heat Sinks
,”
Int. J. Heat Mass Transfer
0017-9310,
46
, pp.
2737
2753
.
4.
Qu
,
W.
, and
Mudawar
,
I.
, 2003, “
Flow Boiling Heat Transfer in Two-Phase Micro-Channel Heat Sinks—I. Experimental Investigation and Assessment of Correlation Methods
,”
Int. J. Heat Mass Transfer
0017-9310,
46
, pp.
2755
2771
.
5.
Mikic
,
B. B.
,
Rohsenow
,
W. M.
, and
Griffith
,
P.
, 1970, “
On Bubble Growth Rates
,”
Int. J. Heat Mass Transfer
0017-9310,
13
, pp.
657
665
.
6.
Mudawar
,
I.
, 2001, “
Assessment of High-Heat-Flux Thermal Management Schemes
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
24
, pp.
122
141
.
7.
Schmidt
,
R.
, 2000, “
Low Temperature CMOS Experience at IBM
,”
16th IEEE SEMI-Therm Symp.
, San Jose, CA, March 21–23, pp.
112
113
.
8.
Lee
,
J.
, and
Mudawar
,
I.
, 2005, “
Two-Phase Flow in High-Heat-Flux Micro-Channel Heat Sink for Refrigeration Cooling Applications: Part I—Pressure Drop Characteristics
,”
Int. J. Heat Mass Transfer
0017-9310,
48
, pp.
928
940
.
9.
Lee
,
J.
, and
Mudawar
,
I.
, 2005, “
Two-Phase Flow in High-Heat-Flux Micro-Channel Heat Sink for Refrigeration Cooling Applications: Part II—Heat Transfer Characteristics
,”
Int. J. Heat Mass Transfer
0017-9310,
48
, pp.
941
955
.
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