The work is aimed to investigate the mechanical responses of bare dies of the combination of pure Under bump metallization (UBM) and packages of pure UBM/substrate of standard thickness of aurum. The mechanical properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From the empirical results of bare dies, the delamination between IMC and die was observed due to the tests at 260 °C multiple reflow. However, their mechanical properties were not affected. Nevertheless, the bump shear strength of bare dies were decreased by HTST tests. In package, all the results of mechanical properties by multiple reflow test and HTST test were significantly lowered. It was shown that the adhesion between bump and die reduced obviously as tests going on. As for high temperature operational life test in the conditions of 150 °C and 320 mA , the average stable service time of the package was 892 h, and the average ultimate service time of the package was 1053 h.
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e-mail: jmhr@mail.nsysu.edu.tw
e-mail: jd wu@asek.asetwn.com.tw
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December 2005
Research Papers
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Ming-Hwa R. Jen,
Ming-Hwa R. Jen
Professor
Department of Mechanical and Electro-Mechanical Engineering,
e-mail: jmhr@mail.nsysu.edu.tw
National Sun Yat-sen University
, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of China
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Lee-Cheng Liu,
Lee-Cheng Liu
Graduate Student
Department of Mechanical and Electro-Mechanical Engineering,
National Sun Yat-sen University
, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of China
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Jenq-Dah Wu
e-mail: jd wu@asek.asetwn.com.tw
Jenq-Dah Wu
Manager
Process Engineering Division
, Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811, Nantze Export Processing Zone, Kaohsiung, Taiwan, Republic of China
Search for other works by this author on:
Ming-Hwa R. Jen
Professor
Department of Mechanical and Electro-Mechanical Engineering,
National Sun Yat-sen University
, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of Chinae-mail: jmhr@mail.nsysu.edu.tw
Lee-Cheng Liu
Graduate Student
Department of Mechanical and Electro-Mechanical Engineering,
National Sun Yat-sen University
, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of China
Jenq-Dah Wu
Manager
Process Engineering Division
, Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811, Nantze Export Processing Zone, Kaohsiung, Taiwan, Republic of Chinae-mail: jd wu@asek.asetwn.com.tw
J. Electron. Packag. Dec 2005, 127(4): 446-451 (6 pages)
Published Online: January 13, 2005
Article history
Received:
August 17, 2004
Revised:
January 13, 2005
Citation
Jen, M. R., Liu, L., and Wu, J. (January 13, 2005). "Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test." ASME. J. Electron. Packag. December 2005; 127(4): 446–451. https://doi.org/10.1115/1.2070090
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