The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow underfill materials are gaining much interest over traditional underfill as the application and curing of this type of underfill can be undertaken before and during the reflow process and thus aiding high volume throughput. However, there is always a potential chance of entrapping no-flow underfill in the solder joints. This work, attempts to find out the extent of underfill entrapment in the solder joints and its reliability effect on the flip chip packages. Some unavoidable underfill entrapments at the edges of the joint between solder bumps and substrate pads are found for certain solder joints whatever bonding conditions are applied. It is interesting to report for the first time that partial underfill entrapment at the edges of the solder joint seems to have no adverse effect on the fatigue lifetime of the samples since most of the first solder joint failure in the no-flow flip chip samples during thermal cycling are not at the site of solder interconnection with underfill entrapment. Our modeling results show good agreement with the experiment that shows underfill entrapment can actually increase the fatigue lifetime of the no-flow flip chip package.
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e-mail: eeycchan@cityu.edu.hk
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December 2004
Research Papers
Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
Y. C. Chan,
Y. C. Chan
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
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M. O. Alam,
e-mail: eeycchan@cityu.edu.hk
M. O. Alam
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
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K. C. Hung,
K. C. Hung
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
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H. Lu,
H. Lu
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
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C. Bailey
C. Bailey
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
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Y. C. Chan
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
M. O. Alam
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
e-mail: eeycchan@cityu.edu.hk
K. C. Hung
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
H. Lu
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
C. Bailey
EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, China
School of Computing and Mathematical Science, The University of Greenwich, Greenwich, UK
Manuscript received May 2003; final revision, April 2004. Review conducted by: B. Sammakia.
J. Electron. Packag. Dec 2004, 126(4): 541-545 (5 pages)
Published Online: January 24, 2005
Article history
Received:
May 1, 2003
Revised:
April 1, 2004
Online:
January 24, 2005
Citation
Chan , Y. C., Alam, M. O., Hung , K. C., Lu , H., and Bailey, C. (January 24, 2005). "Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint ." ASME. J. Electron. Packag. December 2004; 126(4): 541–545. https://doi.org/10.1115/1.1756590
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