Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a widely used computational fluid dynamics (CFD) software. In Part I of this paper, the benchmark test cases, experimental methods and numerical models were described. Component junction temperature prediction accuracy for the populated board case is typically within ±5°C or ±10%, which would not be sufficient for temperature predictions to be used as boundary conditions for subsequent reliability and electrical performance analyses. Neither the laminar or turbulent flow model resolve the complete flow field, suggesting the need for a turbulence model capable of modeling transition. The full complexity of component thermal interaction is shown not to be fully captured.
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, March 9, 2000; revised manuscript received March 1, 2002. Associate Editor: A. Ortega.
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Rodgers, P. J., Eveloy, V. C., and Davies, M. R. (March 14, 2003). "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion ." ASME. J. Electron. Packag. March 2003; 125(1): 76–83. https://doi.org/10.1115/1.1533060
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