CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature. Adhesive fracture toughness of these diamond particles was evaluated. It was confirmed that the adequate control of methane concentration could improve the toughness by almost five times. Discussion is further focused on the difference in the composition of the particles with different levels of adhesive fracture toughness. The graphite content in the diamond particle seems to be closely related to the enhancement of adhesive fracture toughness. Detailed microscopic observations were also carried out on the fracture morphology of the interface and the cross-sections of the diamond particles. Finally, the nanoscale crystalline structure of diamond particles is found to play an important role on the adhesive fracture toughness.
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September 2002
Papers On Reliability
Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate
Shoji Kamiya,
e-mail: kamiya@abe.mech.tohoku.ac.jp
Shoji Kamiya
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
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Hironori Takahashi,
Hironori Takahashi
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
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Masumi Saka,
Masumi Saka
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
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Hiroyuki Abe´
Hiroyuki Abe´
Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan
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Shoji Kamiya
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
e-mail: kamiya@abe.mech.tohoku.ac.jp
Hironori Takahashi
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
Masumi Saka
Tohoku University, Department of Mechanical Engineering, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, Japan
Hiroyuki Abe´
Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD August 20, 1999; revised manuscript received July 23, 2001. Associate Editor: D. T. Read.
J. Electron. Packag. Sep 2002, 124(3): 271-276 (6 pages)
Published Online: July 26, 2002
Article history
Received:
August 20, 1999
Revised:
July 23, 2001
Online:
July 26, 2002
Citation
Kamiya, S., Takahashi , H., Saka, M., and Abe´, H. (July 26, 2002). "Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate ." ASME. J. Electron. Packag. September 2002; 124(3): 271–276. https://doi.org/10.1115/1.1481374
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