In this paper, the authors present a stress analysis technique based on a novel nested finite element methodology (NFEM). The NFEM is similar in concept to an earlier proposed multi-domain Rayleigh-Ritz methodology (Ling, S., 1997, “A Multi-Domain Rayleigh-Ritz Method for Thermomechanical Stress Analysis of Surface Mount Interconnects in Electronic Assemblies,” Ph.D. dissertation, Univ., of Maryland), that is based on a nested multi-field displacement assumption. The nested multi-field displacement technique may be viewed as a localized cascading of the p-type refinement in conventional finite element analysis. The concept and formulation of NFEM are presented in this paper while the application of NFEM to analyze the viscoplastic stress-state in two popular surface mount electronic interconnect styles is presented in Part II of this series. To illustrate the concept of NFEM, the formulation and results are provided for a one-dimensional viscoplastic example.
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters October 10, 2000. Associate Editor: J. Lau
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Darbha, K., and Dasgupta, A. (October 10, 2000). "A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation ." ASME. J. Electron. Packag. June 2001; 123(2): 141–146. https://doi.org/10.1115/1.1328744
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