Tools and goals of microstructural stress analysis are reviewed. Common misconceptions regarding the analysis are explored. [S1043-7398(00)00703-9]
Issue Section:
Technical Briefs
Topics:
Stress analysis (Engineering)
1.
Orringer, O. and Tong, P., 1984, “Uses and abuses of the finite element method,” Proceedings of SPIE, the International Society for Optical Engineering, Vol. 450, Bellingham, Washington, DC, pp. 2–33.
2.
Subbarayan
, G.
, Ramakrishna
, K.
, and Sammakia
, B. G.
, 1997
, “The Impact of Interfacial Adhesion on PTH and Via Stress State
,” ASME J. Electron. Packag.
, 119
, pp. 260
–267
.3.
Engelmaier
, W.
, 1988
, “Plated Through Hole Failures in Thermal Cycling: Analytical Considerations,” Technical Report
IPC-TR-579
, Lincolnwood, IL.
4.
Mirman
, B.
, 1988
, “Mathematical Model of a Plated-Through Hole under a Load Induced by Thermal Mismatch
,” IEEE Trans., CHMT
, 11
, No. 4
, pp. 506
–511
.5.
Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” American Electroplaters and Surface Finishers Society, Handbook.
Copyright © 2000
by ASME
You do not currently have access to this content.