Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits uneven thermal deformation in the whole temperature range during thermal cycling. This behavior will affect the buildup of thermal strain/stress within the package, which may affect the reliability of the package. Therefore, a real-time method is needed to monitor the thermal deformation of packages during the thermal cycling. In this study, a real-time moire´ interferometry technique coupled with a thermal vacuum chamber is used to monitor the thermal deformation of a plastic package. A grating is transferred onto the cross section of the sample at room temperature. The fringe patterns are recorded by a CCD camera system and are compared with the displacement contours obtained by nonlinear finite element simulation. High temperature moire´ results up to 200°C are reported here. The comparison between the moire´ fringe patterns and finite element results shows a good agreement. The results also show that the real-time moire´ interferometry technique is an effective way to monitor the thermal deformation of electronic packaging and is a powerful validation method for finite element analysis.

Issue Section:
Special Section Technical Papers
Topics:
Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement, Electronic packages, Failure, High temperature, Packaging, Stress, Vacuum
1.
Guo
Y.
,
Lim
C. K.
,
Chen
W. T.
, and
Woychik
C. G.
,
1993
, “
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,”
IBM J. of Research and Development
, Vol.
37
, No.
5
, pp.
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–
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.
2.
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3.
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4.
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5.
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6.
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7.
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8.
Zhu, J. S., 1996, “Modeling and Validation of Thermally-Induced Failure Mechanisms in Microelectronic Packaging,” Ph.D. dissertation, Mechanical Engineering Department, Wayne State University, Detroit, MI.
9.
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10.
Zhu, J. S., Zou, D. Q., Dai, F. L., and Liu, S., 1996b, “High Temperature Deformation Analysis of A Flip-Chip Assembly by Moire´ Interferometry,” Proceedings of 1996 International Electronics Manufacturing Technology Symposium, Austin, Texas, Oct. 14–16.
11.
Zhu, J. S., Zou, D. Q., Liu, S., and Benson, J., 1996c, “Thermal Behavior Study of Power Plastic Package by High Temperature Moire´ Interferometry and FEA Modeling,” Proceedings of the International Mechanical Engineering Congress and Exposition, EEP-Vol. 16, Structural Analysis in Microelectronics and Fiber Optics, Atlanta, Georgia, Nov. 17–22.
12.
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13.
Zhu, J. S., Zou, D. Q., Dai, F. L., and Liu, S., 1997a, “High Temperature Deformation Analysis of High Density Interconnects and Packages by High Density Moire´ Interferometry,” Experimental/Numerical Mechanics in Electronic Packaging (E/NMEP), Vol. 1.
14.
Zhu, J. S., and Liu, S., 1997a, “Thermal Deformation and Stress Analysis of a Column Grid Array Package by Hybrid Moire´/FEM Method,” presented at the 9th Symposium on Mechanics of Surface Mount Assemblies, International Mechanical Engineering Congress, Dallas, Nov. 16–21.
15.
Zhu, J. S., Zou, D. Q., and Liu, S., 1997b, “Real Time Monitoring and Simulations of Thermal Deformations in Plastic Package,” presented at the International Mechanical Engineering Congress, Dallas, Nov. 16–21.
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