The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

Issue Section:
Technical Papers
Topics:
Ball-Grid-Array packages, Ball-Grid-Array packaging, Copper, Deflection, Epoxy adhesives, Epoxy resins, Flat heat pipes, Glass, Printed circuit boards, Temperature distribution, Thermal resistance, Warping
1.
ANSYS, 1996, “User’s Manual 5.3,” Swanson Analysis Systems, Inc., Houston PA.
2.
Gillis J. C., and Kuo, A. Y., 1996, private communication with the authors.
3.
Lau, J. H., 1994, “Handbook of Fine Pitch Surface Mount Technology,” Van Nostrand Reinhold, New York, NY.
4.
Lau, J. H., 1995, “Ball Grid Array Technology,” McGraw-Hill, New York, NY.
5.
Lau, J. H., and Pao, Y. H., 1997, “Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies,” McGraw-Hill, New York, NY.
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Copyright © 1997
 by The American Society of Mechanical Engineers
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