Issue Section:
Technical Papers
Topics:
Adhesives, Fracture toughness
1.
ABAQUS, 1996, Hibbit, Karlsson & Sorensen, Inc., Pawtucket, RI 02860.
2.
Balendran
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1994
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On the Double Cantilever Beam Specimen for Mode-I Interface Delamination
,”
ASME Journal of Applied Mechanics
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61
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3.
Berry
J. P.
,
1963
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Determination of Fracture Surface Energies by the Cleavage Technique
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4.
Gaynes, M. A., and Shaukatullah, H., 1993, “Evaluation of Thermally Conductive Adhesives for Bonding Heat Sinks to Electronic Packages,” Proceeding of 43rd Electronic Components and Technology Conference, June 1–4, Orlando, Florida, pp. 765–771.
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Gilman
J. J.
,
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Direct Measurements of the Surface Energies of Crystals
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Hultmark, E., Horvath, J. L., Trestman-Matts, A. and Park, C., 1986, “The Use of Silicone Adhesives in Microelectronic Packaging,” Proceedings of the Sixth Annual IEPS Conference, Nov. 17–19, San Diego, CA, pp. 340–348.
7.
Peterson, G. P., and Fletcher, L. S., 1987, “Thermal Contact Resistance of Silicon Chip Bonding Materials,” Proceedings of International Symposium on Cooling Technology for Electronic Equipment, March, Hawaii, pp. 523–533.
8.
Ripling, E. J., Mostovoy, S., and Patrick, R. L., 1964, “Application of Fracture Mechanics to Adhesive Joints,” Adhesion, ASTM STP 360, pp. 5–19.
9.
Sancaktar, E., 1990, “Static and Dynamic Fatigue Testing,” Adhesives and Sealants, Engineered Materials Handbook, Vol. 3, pp. 349–372.
10.
Sancaktar, E., 1990, “Fatigue and Fracture Mechanics,” Adhesives and Sealants, Engineered Materials Handbook, Vol. 3, pp. 501–520.
11.
Twizell
E. H.
, and
Ogden
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1983
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Non-Linear Optimization of the Material Constants in Ogden’s Stress-Deformation Function for Incompressible Isotropic Elastic Materials
,”
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 by The American Society of Mechanical Engineers

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