Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.
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September 1995
Technical Papers
Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
B. Han
IBM Microelectronics Division, IBM Corporation, Endicott, NY 13760
Y. Guo
IBM Microelectronics Division, IBM Corporation, Endicott, NY 13760
J. Electron. Packag. Sep 1995, 117(3): 185-191 (7 pages)
Published Online: September 1, 1995
Article history
Received:
August 1, 1994
Revised:
May 12, 1995
Online:
November 6, 2007
Citation
Han, B., and Guo, Y. (September 1, 1995). "Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry." ASME. J. Electron. Packag. September 1995; 117(3): 185–191. https://doi.org/10.1115/1.2792090
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