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Journal Articles

A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders

Yao Yao, Xu Long, Leon M. Keer
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. July 2017, 69(4): 040802.
Paper No: AMR-17-1013
https://doi.org/10.1115/1.4037462
Published Online: August 16, 2017
View Article titled, A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders
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Topics: Creep, Damage, Electrodiffusion, Fatigue, Fatigue life, Lead-free solders, Solder joints, Solders, Stress, Temperature
Journal Articles

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Y. H. Yau, Shijie Norman Hua
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. March 2011, 64(2): 020803.
https://doi.org/10.1115/1.4005283
Published Online: December 7, 2011
View Article titled, A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices
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Topics: Computer simulation, Dynamic response, Electronic products, Failure, Finite element analysis, Modeling, Printed circuit boards, Reliability, Solder joints, Solders
Journal Articles

Quasi-Analytic Sensitivity Analysis of a Unified Viscoplastic Constitutive Model for a Solder Alloy

Martin A. Eisenberg, Erhard Krempl, Luca Maciucescu
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. November 1997, 50(11S): S44–S49.
https://doi.org/10.1115/1.3101849
Published Online: November 1, 1997
View Article titled, Quasi-Analytic Sensitivity Analysis of a Unified Viscoplastic Constitutive Model for a Solder Alloy
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Topics: Alloys, Constitutive equations, Sensitivity analysis, Solders, Design, Algebra, Complex systems, Modeling, Optimization, Teams