...Xiaojie Ma; Hao Long; Yueguang Wei The emerging skin-integrated devices have been embedded with various functions, whose ideal implementation typically relies on intact bonding to curved substrates. However, the predeformation, which originates from the attachment of a thin film to a curved...

... by the Applied Mechanics Division of ASME for publication in the J ournal of A pplied M echanics . 10 04 2020 21 05 2020 22 05 2020 08 07 2020 stress analysis thin films wafer curvature elasticity micromechanics structures Residual stress in thin films...

... of compressive pre-stress for a layer ( ν = 0.25) to compressive pre-stress for a plate versus unbonded length to thickness ratio (2 L / h ) The buckling of a thin film adhering, without friction, to a rigid foundation has been investigated. It is assumed that a finite portion of the film...

... yields deflection of the plate. We recall Stoney’s analytical formula linking the total mechanical stresses to this deflection. We also derive a relationship between the prestresses and the deflection. We relax Stoney’s assumption of very thin films. The analytical formulas are derived by assuming...

...Antonios Kontsos; Chad M. Landis A computational model developed based on the phase-field approach is used to model domain structures in ferroelectric thin films and to quantify the effects of strain and applied electric field on the microstructural evolution, and on the induced dielectric...

... of Stability of Colloids and Thin Films , Consultants Bureau , New York . Wan , K. -T. , and Lawn , B. R. , 1992 , “ Effect of Chemical Interaction on Barenblatt Crack Profiles in Brittle Solids ,” Acta Metall. Mater. , 40 ( 2 ), pp. 3331 – 3337 . 0956-7151 Lawn , B. R. , 1993...

...Mehmet A. Guler In this study, the contact problems of thin films and cover plates are considered. In these problems, the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses...

... the ratio of hardness and the yield stress of the coating film is 3.5 < H A ∕ σ y < 4.5 . 18 05 2006 30 08 2007 04 04 2008 delamination elastic constants indentation thin films yield stress The delamination of thin coating films from substrates is a critical issue...

...X. Feng; Y. Huang; A. J. Rosakis Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular...

... stress, which can be integrated with conventional thin film mechanics to quantify device performance in terms of molecular inputs. The decoupling of molecular and continuum frameworks enables a straightforward analysis of arbitrary structures and deformation modes, e.g., buckling and plate/membrane...

... Stoney’s formula incorporating the effects of both the layer dimensions and interfacial slip is presented. 06 09 2006 19 03 2007 11 01 2008 thin films substrates interface structure slip elasticity Almost all solid-state electronic components have the basic structure...

...X. Feng; Y. Huang; A. J. Rosakis Current methodologies used for the inference of thin film stress through system curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. Recently Huang, Rosakis, and co...

... or heterogeneities (as in adhesives reinforced by particles). 18 01 2006 27 06 2006 thin films numerical analysis elasticity The aim of this study was to perform a first-order asymptotic and numerical analysis on linear thin layers. The rigidity of the thin layers is assumed here...

...Y. Huang; A. J. Rosakis Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. By considering a circular thin film/substrate...

..., such as friction and wear. 28 07 2004 02 12 2005 diamond-like carbon oxygen chemisorbed layers adsorbed layers sliding friction wear surface phase transformations surface roughness dissociation bonds (chemical) ab initio calculations thin films This paper deals...

...S. H. Im; R. Huang This paper develops a model for evolving wrinkles in a bilayer thin film consisting of an elastic layer and a viscoelastic layer. The elastic layer is subjected to a compressive residual stress and is modeled by the nonlinear von Karman plate theory. A thin-layer approximation...

... of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS for publication in the ASME JOURNAL OF APPLIED MECHANICS . Manuscript received by the Applied Mechanics Division, October 27, 1999; final revision, June 17, 2004. Editor: R. M. McMeeking. 27 October 1999 17 June 2004 15 03 2005 thin films...

..., and will be accepted until four months after final publication in the paper itself in the ASME JOURNAL OF APPLIED MECHANICS . Summary of literature addressing point and pressure loading of thin films Linear (purebending or pretensionedmembrane) Nonlinear (bending and stretching) Small rotations...

...R. Krishnamurthy; D. J. Srolovitz We present closed-form solutions for stresses in a thin film resulting from a purely dilatational stress-free strain that can vary arbitrarily within the film. The solutions are specific to a two-dimensional thin film on a thick substrate geometry and are presented...

...R. Kukta, Assoc. Mem. ASME, Assistant Professor; A. Peralta, Assoc. Mem. ASME, Assistant Professor; D. Kouris, Mem. ASME, Professor The elastic interaction between surface steps biases growth and can have a dominant influence on growth modes of thin films. A new continuum solution is presented...