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Keywords: thermal cycling
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Paper No: IPACK2021-73197
... Printing (AJP); Thermal Cycling; internal cohesive crack formation), lower Finite-Element Modeling (FEM); Nano- product quality, and reduced reliability [6, 8]. indentation; Durability and reliability of AJP conductive traces subject to long-term temperature cycling are important attributes. Many This work...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Paper No: IPACK2020-2655
...CREEP BEHAVIOR OF VARIOUS MATERIALS WITHIN PBGA PACKAGES SUBJECTED TO THERMAL CYCLING LOADING Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849 Phone: +1-334-844-3332 FAX: +1-334...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019
Paper No: IPACK2019-6471
...NANOINDENTATION TESTING OF SAC305 SOLDER JOINTS SUBJECTED TO THERMAL CYCLING LOADING Abdullah Fahim, S M Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849 Phone: +1-334-844-3332 FAX: +1-334-844...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Paper No: IPACK2019-6385
... of thermal cycles. Keywords: Latent Heat, Field s Metal, Wood s Metal, Thermal Cycling, Thermal Stability, Passive Cooling. NOMENCLATURE Tm melting temperature Hf latent heat of fusion mPCMs metallic Phase Change Materials mW milliwatts 1. INTRODUCTION Phase change materials (PCMs) are widely used in various...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A005, July 16–18, 2013
Paper No: IPACK2013-73244
...-static) temperature changes from 0 to 100 C. In later testing, long term thermal cycling of selected parts was performed from 0 to 100 C (40 minute cycle, 10 minute ramps and dwells). After various durations of cycling, the sensor resistances at critical locations on the die device surface (e.g. die...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 359-364, July 8–12, 2007
Paper No: IPACK2007-33247
..., 2) use this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seeking an optimum design, and 3) develop a similar life prediction model for lead-free solder materials. Solder Joint Thermal Cycling Fatigue CCGA 1 Copyright ©...