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1-7 of 7
Keywords: thermal aging
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
... characteristics of undoped SAC105 and doped SAC-Q solder alloys at low operation temperatures (−65°C to 0°C) at high strain rate after varied thermal aging periods up to one year. In addition, the evolution of Anand parameters for SAC solder alloys after prolonged thermal aging has been studied. The Anand model’s...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
... pristine and aged tests, the damage accumulation is predicted using the interfacial fracture parameters from the experiment. Keywords: Isothermal Exposure, Thermal Aging, Cohesive Zone Modeling, Interfacial Fracture Toughness, Delamination, Epoxy/PCB Interface, Delamination, Potting Compounds. 1...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
... isothermal exposure FCBGA thermal aging interfacial fracture toughness delamination chip/underfill Abstract Underhood applications in automotive are increasingly using electronics systems for safety and critical functions. In flip-chip ball grid array (FCBGA) packages, underfill (UF...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Paper No: IPACK2021-74068
... to high strain-rate at high and low operational temperatures in a number of extreme Keywords: High Strain rate, doped solders, SAC105, SAC- applications such as the downhole drilling, aerospace, defense, Q, Thermal Aging, Anand Viscoplastic Model. and automotive. Temperature in these electronic assemblies...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
... between experimental data and Anand predicted data. Keywords: High strain rate, SAC105, SAC-Q, Thermal Aging, Anand Viscoplastic model. NOMENCLATURE SAC SnAgCu 1 Contact author: lall@auburn.edu; Tele: (334) 844-3424. A Cross-sectional area, mm2 c Function of Strain rate and Temperature F Force E Elastic...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Paper No: IPACK2019-6521
... the reliability issues found in electronic packages. This current investigation deals with the review of mechanical property degradations of SAC305(Sn-96.5Ag-3.0Cu-0.5) solder materials due to thermal aging and their effects on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
... devices. Temperatures in these applications can exceed 200°C, which is closed to melting point for SAC alloys. The microstructure for lead free solder alloys constantly evolves when subjected to thermal aging for sustained periods with accompanying degradation in mechanical properties of solder alloys...
