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Keywords: simulations
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Paper No: IPACK2021-72620
... simulation code previously presented at InterPACK 2019 and InterPACK 2020 is considered. To facilitate the industrial transition to thermosyphon cooling technology, with its intrinsic complex flow phenomena, the availability of a general-use, widely validated design tool that handles both air-cooled...